Mekhoa ea hajoale ea liphutheloana tsa semiconductor e ntse e ntlafala butle-butle, empa tekanyo eo lisebelisoa le mahlale a ikemetseng li amoheloang ka har'a liphutheloana tsa semiconductor ka kotloloho e lekanya ho phethahala ha liphetho tse lebelletsoeng.Lits'ebetso tse ntseng li le teng tsa ho paka tsa semiconductor li ntse li na le bofokoli bo salletseng morao, 'me litsebi tsa likhoebo ha li so sebelise lisebelisoa tsa ho paka tse ikemetseng ka botlalo.Ka lebaka leo, lits'ebetso tsa ho paka tsa semiconductor tse haelloang ke ts'ehetso ho tsoa ho mahlale a taolo a ikemetseng li tla tlisa litšenyehelo tse phahameng tsa basebetsi le nako, e leng ho etsang hore ho be thata ho litsebi ho laola ka thata boleng ba liphutheloana tsa semiconductor.
E 'ngoe ea libaka tse ka sehloohong tse lokelang ho hlahlojoa ke phello ea mekhoa ea ho paka ka botšepehi ba lihlahisoa tse tlaase tsa k.Botšepehi ba segokanyimmediamentsi sa khauta-aluminium bonding terata angoa ke lintho tse kang nako le mocheso, ho etsa hore ho tšepahala ha eona ho fokotseha ha nako e ntse e ea le ho fella ka liphetoho mokhahlelong oa eona oa lik'hemik'hale, tse ka lebisang ho delamination ts'ebetsong .Ka hona, ho bohlokoa ho ela hloko taolo ea boleng boemong bo bong le bo bong ba ts'ebetso.Ho theha lihlopha tse khethehileng bakeng sa mosebetsi o mong le o mong ho ka thusa ho sebetsana le litaba tsena ka hloko.Ho utloisisa sesosa sa mathata a tloaelehileng le ho nts'etsapele litharollo tse lebisitsoeng, tse tšepahalang ke tsa bohlokoa bakeng sa ho boloka boleng ba ts'ebetso ka kakaretso.Haholo-holo, maemo a pele a lithapo tsa ho kopanya, ho kenyelletsa le liphaephe tsa ho kopanya le lisebelisoa tse ka tlaase le mehaho, li tlameha ho hlahlojoa ka hloko.Sebaka sa marang-rang se tlameha ho bolokoa se hloekile, 'me khetho le ts'ebeliso ea lisebelisoa tsa terata tse tlamang, lisebelisoa tsa tlamahano le liparamente tsa bonding li tlameha ho fihlela litlhoko tsa ts'ebetso ho isa tekanyong e phahameng.Ho khothaletsoa ho kopanya theknoloji ea ts'ebetso ea k koporo e nang le bonding e ntle ho netefatsa hore phello ea khauta-aluminium IMC mabapi le ho ts'epahala ha liphutheloana e totobatsoa haholo.Bakeng sa lithapo tse tlamang hantle, deformation efe kapa efe e ka ama boholo ba libolo tsa bonding mme ea thibela sebaka sa IMC.Ka hona, taolo e tiileng ea boleng nakong ea sethala se sebetsang sea hlokahala, ka lihlopha le basebetsi ba hlahloba ka botlalo mesebetsi le boikarabello ba bona, ho latela litlhoko tsa ts'ebetso le litloaelo ho rarolla litaba tse ling.
Ts'ebetsong e felletseng ea liphutheloana tsa semiconductor e na le sebopeho sa botsebi.Litsebi tsa likhoebo li tlameha ho latela ka tieo mehato ea ts'ebetso ea semiconductor package ho sebetsana le likarolo hantle.Leha ho le joalo, basebetsi ba bang ba likhoebo ha ba sebelise mekhoa e emeng ho phethela mokhoa oa ho paka semiconductor esita le ho hlokomoloha ho netefatsa lintlha le mehlala ea likarolo tsa semiconductor.Ka lebaka leo, likarolo tse ling tsa semiconductor li phuthetsoe ka phoso, li thibela semiconductor ho etsa mesebetsi ea eona ea mantlha le ho ama melemo ea moruo ea khoebo.
Ka kakaretso, boemo ba tekheniki ba liphutheloana tsa semiconductor bo ntse bo hloka ho ntlafatsoa ka mokhoa o hlophisehileng.Litsebi tsa likhoebo tse etsang li-semiconductor li lokela ho sebelisa lisebelisoa tsa ho paka ka boiketsetso ho netefatsa kopano e nepahetseng ea likarolo tsohle tsa semiconductor.Bahlahlobi ba boleng ba boleng ba lokela ho etsa litlhahlobo tse felletseng le tse tiileng ho tseba ka nepo lisebelisoa tsa semiconductor tse pakiloeng ka nepo le ho khothaletsa litsebi ho etsa litokiso tse sebetsang.
Ho feta moo, molemong oa taolo ea boleng ba boleng ba terata, tšebelisano lipakeng tsa lera la tšepe le lera la ILD sebakeng sa ho tlama mohala ho ka lebisa ho delamination, haholoholo ha terata e kopanyang terata le lesela le ka tlase la tšepe / ILD le fetoha sebopeho sa senoelo. .Sena se bakoa haholo ke khatello le matla a ultrasonic a sebelisoang ke mochine o kopanyang terata, oo butle-butle o fokotsang matla a ultrasonic le ho o fetisetsa sebakeng sa terata, ho thibela ho arohana ha khauta le liathomo tsa aluminium.Boemong ba pele, litlhahlobo tsa khokahanyo ea terata e tlase ea k li senola hore mekhoa ea bonding e na le kutloelo-bohloko haholo.Haeba li-parameter tsa bonding li behiloe tlase haholo, litaba tse kang ho robeha ha terata le li-bond tse fokolang li ka hlaha.Ho eketsa matla a ultrasonic ho lefella sena ho ka fella ka tahlehelo ea matla le ho mpefatsa deformation e bōpehileng joaloka senoelo.Ho phaella moo, ho khomarela ho fokolang pakeng tsa lesela la ILD le lesela la tšepe, hammoho le brittleness ea thepa e tlaase-k, ke mabaka a ka sehloohong a delamination ea lera la tšepe ho tloha lera la ILD.Lintlha tsena ke tse ling tsa liqholotso tse kholo taolong ea boleng ba boleng ba semiconductor ea ho paka le boqapi.
Nako ea poso: May-22-2024