Karolo e ka pele, e bohareng le e ka morao ea mela ea tlhahiso ea semiconductor
Mokhoa oa ho etsa semiconductor o ka aroloa ka mekhahlelo e meraro:
1) Qetello e ka pele ea mohala
2) Qetellong ea moeli
3) Qetellong ea moeli
Re ka sebelisa papiso e bonolo joalo ka ho aha ntlo ho hlahloba ts'ebetso e rarahaneng ea tlhahiso ea li-chip:
Karolo e ka pele ea mohala oa tlhahiso e tšoana le ho beha motheo le ho haha marako a ntlo. Ha ho etsoa li-semiconductor, sethala sena se kenyelletsa ho theha meaho ea mantlha le li-transistors holim'a lesela la silicon.
Mehato ea bohlokoa ea FEOL:
1.Ho hloekisa: Qala ka sephaphatha sa silicon se tšesaane 'me u se hloekise ho tlosa litšila leha e le life.
2.Oxidation: Holisa lera la silicon dioxide holim'a sephaphatha ho arola likarolo tse fapaneng tsa chip.
3. Photolithography: Sebelisa photolithography ho tšoaea lipaterone holim'a sephaphatha, ho tšoana le ho taka lipolane tse nang le khanya.
4.Etching: Etch hole sa batleheng silicon dioxide e ho senola a lakatsa dipaterone.
5.Doping: Hlahisa litšila ka har'a silicon ho fetola thepa ea eona ea motlakase, ho etsa li-transistors, li-block tsa motheo tsa chip leha e le life.
Mafelo a Bohareng ba Mola (MEOL): Ho hokahanya Matheba
Bohareng ba mohala oa tlhahiso ho tšoana le ho kenya wiring le lipeipi tsa metsi ka tlung. Mokhahlelo ona o shebane le ho theha likhokahano lipakeng tsa li-transistors tse entsoeng sethaleng sa FEOL.
Mehato ea bohlokoa ea MEOL:
1.Dielectric Deposition: Deposit insulating layers (e bitsoang dielectrics) ho sireletsa li-transistors.
2.Contact Formation: Etsa mabitso ho hokahanya li-transistors ho e mong le lefats'e le ka ntle.
3.Interconnect: Eketsa lirafshoa tsa tšepe ho etsa litsela tsa matšoao a motlakase, tse ts'oanang le ho kopanya ntlo ho netefatsa hore matla a seamless le phallo ea data.
Qetellong ea Mola (BEOL): Finishing Touches
Karolo e ka morao ea mohala oa tlhahiso e tšoana le ho eketsa lintlha tsa ho qetela tsa ntlo-ho kenya lisebelisoa, ho penta le ho netefatsa hore ntho e 'ngoe le e' ngoe e sebetsa. Ha ho etsoa li-semiconductor, sethala sena se kenyelletsa ho kenyelletsa likarolo tsa ho qetela le ho lokisa chip bakeng sa ho paka.
Mehato ea bohlokoa ea BEOL:
1.Likarolo tse eketsehileng tsa Metal: Eketsa likarolo tse ngata tsa tšepe ho matlafatsa ho hokahanya, ho netefatsa hore chip e ka sebetsana le mesebetsi e rarahaneng le lebelo le phahameng.
2.Passivation: Sebelisa likarolo tse sireletsang ho sireletsa chip ho senya tikoloho.
Teko ea 3.Tlhahiso: Etsa tlhahlobo e matla ea chip ho netefatsa hore e kopana le litlhaloso tsohle.
4.Dicing: Khaola sephaphatha ka lichipisi ka bomong, e 'ngoe le e' ngoe e loketse ho paka le ho sebelisoa lisebelisoa tsa elektroniki.
Semicera ke moetsi ea ka sehloohong oa OEM naheng ea China, ea inehetseng ho fana ka boleng bo ikhethang ho bareki ba rona. Re fana ka mefuta e fapaneng ea lihlahisoa le lits'ebeletso tsa boleng bo holimo, ho kenyelletsa:
1.CVD SiC Coating(Epitaxy, likarolo tse koahetsoeng ka CVD tse tloaelehileng, liphahlo tse sebetsang hantle bakeng sa lits'ebetso tsa semiconductor, le tse ling)
2.Likarolo tse ngata tsa CVD SiC(Etch mehele, mehele e tsepamisitsoeng maikutlo, likarolo tsa tloaelo tsa SiC bakeng sa lisebelisoa tsa semiconductor, le tse ling)
3.Likarolo tse koahetsoeng ke CVD TaC(Epitaxy, kholo ea SiC wafer, lisebelisoa tsa mocheso o phahameng, le tse ling)
4.Likarolo tsa Graphite(Likepe tsa graphite, likarolo tsa tloaelo tsa graphite bakeng sa ts'ebetso e phahameng ea mocheso, le tse ling)
5.Likarolo tsa likarolo tsa SiC(Likepe tsa SiC, li-tubes tsa SiC, likarolo tsa tloaelo tsa SiC bakeng sa ts'ebetso e tsoetseng pele ea thepa, le tse ling)
6.Likarolo tsa Quartz(Likepe tsa quartz, likarolo tsa tloaelo tsa quartz bakeng sa liindasteri tsa semiconductor le letsatsi, le tse ling)
Boitlamo ba rona ba bokhabane bo netefatsa hore re fana ka litharollo tse ncha le tse tšepahalang bakeng sa liindasteri tse fapaneng, ho kenyeletsoa tlhahiso ea semiconductor, ts'ebetso ea thepa e tsoetseng pele, le lits'ebetso tsa theknoloji e phahameng. Ka ho shebana le ho nepahala le boleng, re ikemiselitse ho fihlela litlhoko tse ikhethang tsa moreki e mong le e mong.
Nako ea poso: Dec-09-2024