Thuto ka semiconductor shoamokhoa oa ho kopanya, ho kenyelletsa mokhoa oa ho khomarela, mokhoa oa eutectic bonding, mokhoa o bonolo oa ho kopanya solder, mokhoa oa silevera oa ho kopanya, mokhoa o chesang oa ho kopanya o chesang, mokhoa oa flip chip bonding. Mefuta le matšoao a bohlokoa a tekheniki a lisebelisoa tsa semiconductor die bonding li hlahisoa, boemo ba nts'etsopele bo hlahlojoa, 'me mokhoa oa nts'etsopele o lebelletsoe.
1 Kakaretso ea indasteri ea semiconductor le liphutheloana
Indasteri ea semiconductor e kenyelletsa ka ho khetheha lisebelisoa le lisebelisoa tsa semiconductor tse holimo, tlhahiso ea semiconductor e bohareng, le lits'ebetso tse tlase. indasteri ea naha ea heso e qalile ka morao ho nako, empa ka mor'a lilemo tse ka bang leshome tsa tsoelo-pele e potlakileng, naha ea heso e fetohile 'maraka o moholo oa lefats'e oa lihlahisoa tsa lihlahisoa tsa semiconductor le' maraka o moholo ka ho fetisisa lefatšeng oa lisebelisoa tsa semiconductor. Indasteri ea semiconductor e ntse e tsoela pele ka potlako ka mokhoa oa moloko o le mong oa lisebelisoa, moloko o le mong oa ts'ebetso, le moloko o le mong oa lihlahisoa. Patlisiso mabapi le ts'ebetso ea semiconductor le lisebelisoa ke matla a mantlha a ts'ebetso ea tsoelo-pele e tsoelang pele ea indasteri le tiisetso ea kholo ea indasteri le tlhahiso e kholo ea lihlahisoa tsa semiconductor.
Nalane ea nts'etsopele ea theknoloji ea ho paka ka semiconductor ke nalane ea ntlafatso e tsoelang pele ea ts'ebetso ea chip le miniaturization e tsoelang pele ea litsamaiso. Matla a ka hare a ho khanna a theknoloji ea ho paka a fetohile ho tloha lefapheng la li-smartphone tsa maemo a holimo ho ea ho masimo a kang k'homphieutha e sebetsang hantle le bohlale ba maiketsetso. Mehato e mene ea nts'etsopele ea theknoloji ea semiconductor packaging e bontšoa ho Lethathamo la 1.
Ha li-semiconductor lithography process node li ntse li tsoela pele ho ea ho 10 nm, 7 nm, 5 nm, 3 nm, le 2 nm, R & D le litšenyehelo tsa tlhahiso li ntse li eketseha, sekhahla sa lihlahisoa se fokotseha, 'me Molao oa Moore oa fokotseha. Ho ea ka pono ea mekhoa ea nts'etsopele ea indasteri, eo hajoale e hatelletsoeng ke meeli ea 'mele ea sekhahla sa transistor le keketseho e kholo ea litšenyehelo tsa tlhahiso, ho paka ho ntse ho tsoela pele ka lehlakoreng la miniaturization, letsoalo le phahameng, ts'ebetso e phahameng, lebelo le holimo, maqhubu a phahameng le kopanyo e phahameng. Indasteri ea semiconductor e kene nakong ea post-Moore, 'me lits'ebetso tse tsoetseng pele ha li sa shebana feela le nts'etsopele ea li-node tsa theknoloji ea ho etsa li-wafer, empa butle-butle li fetohela theknoloji e tsoetseng pele ea ho paka. Theknoloji e tsoetseng pele ea ho paka e ke ke ea ntlafatsa feela mesebetsi le ho eketsa boleng ba sehlahisoa, empa hape ka katleho e fokotsa litšenyehelo tsa tlhahiso, e fetoha tsela ea bohlokoa ea ho tsoela pele ka Molao oa Moore. Ka lehlakoreng le leng, theknoloji ea core particle e sebelisoa ho arola litsamaiso tse rarahaneng ka har'a mahlale a mangata a ho paka a ka kenngoeng ka har'a liphutheloana tse fapaneng le tse fapaneng. Ka lehlakoreng le leng, thekenoloji ea tsamaiso e kopanetsoeng e sebelisetsoa ho kopanya lisebelisoa tsa thepa le mehaho e fapaneng, e nang le melemo e ikhethang ea ts'ebetso. Ho kopanngoa ha mesebetsi e mengata le lisebelisoa tsa lisebelisoa tse fapaneng ho phethahala ka ho sebelisa theknoloji ea microelectronics, 'me tsoelo-pele ho tloha lipotolohong tse kopantsoeng ho ea ho litsamaiso tse kopantsoeng lia phethahala.
Packaging ea semiconductor ke sebaka sa ho qala sa tlhahiso ea chip le borokho lipakeng tsa lefats'e la kahare la chip le sistimi ea kantle. Hona joale, ho phaella ho lik'hamphani tse tloaelehileng tsa ho paka le ho hlahloba li-semiconductor, semiconductorsephaphathametheo, lik'hamphani tsa meralo ea semiconductor, le lik'hamphani tse kopaneng tsa likarolo li ntse li tsoela pele ho nts'etsapele liphutheloana tse tsoetseng pele kapa mahlale a bohlokoa a ho paka a amanang.
Mekhoa e ka sehloohong ea theknoloji ea ho paka ea setso kesephaphathatšesaane, ho itšeha, shoa bonding, terata tlama, ho tiisoa ka polasetiki, electroplating, ho itšeha likhopo le ho bōpa, joalo-joalo Har'a bona, ho shoa bonding tshebetso ke e 'ngoe ea mekhoa e rarahaneng ka ho fetisisa le e mahlonoko a liphutheloana, le thepa ea ho shoa bonding tshebetso e boetse ke e' ngoe ea. thepa ea bohlokoa ka ho fetisisa ea ho paka ka semiconductor, 'me ke e' ngoe ea lisebelisoa tsa ho paka tse nang le boleng bo phahameng ka ho fetisisa ba mmaraka. Leha theknoloji e tsoetseng pele ea ho paka e sebelisa lits'ebetso tse ka pele tse kang lithography, etching, metallization, le planarization, ts'ebetso ea bohlokoahali ea ho paka e ntse e le ts'ebetso ea bonding.
2 Semiconductor die bonding process
2.1 Kakaretso
Ts'ebetso ea ho kopanya lefu e boetse e bitsoa chip loading, core loading, die bonding, chip bonding process, joalo-joalo Mokhoa oa ho kopanya oa lefu o bontšoa ho Setšoantšo sa 1. Ka kakaretso, ho kopanya lefu ke ho nka chip ho tloha sephakeng ho sebelisa hlooho ea welding. nozzle e sebelisang vacuum, 'me u e behe sebakeng se khethiloeng sa foreimi e etellang pele kapa substrate ea ho paka tlas'a tataiso ea pono, e le hore chip le pad li tlamahane. tsitsitseng. Boleng le ts'ebetso ea ts'ebetso ea li-die bonding li tla ama ka kotloloho boleng le katleho ea khokahanyo ea terata e latelang, ka hona, bonding ke e 'ngoe ea mahlale a bohlokoa ts'ebetsong ea morao-rao ea semiconductor.
Bakeng sa lits'ebetso tse fapaneng tsa ho paka sehlahisoa sa semiconductor, hajoale ho na le mekhoa e tšeletseng ea mantlha ea ho kopanya li-die, e leng li-adhesive bonding, eutectic bonding, soft solder bonding, silver sintering bonding, hot pressing bonding, le flip-chip bonding. Ho fihlella bonding e ntle ea chip, hoa hlokahala ho etsa hore likarolo tsa bohlokoa tsa ts'ebetso ea lefu la bonding li sebelisane, haholo-holo ho kenyelletsa lisebelisoa tsa bonding, mocheso, nako, khatello le lintho tse ling.
2. 2 Mokhoa oa ho kopanya o khomarelang
Nakong ea tlamahano ea sekhomaretsi, palo e itseng ea sekhomaretsi e lokela ho sebelisoa ho foreime e etellang pele kapa substrate ea sephutheloana pele e beha chip, ebe hlooho ea bonding e nka chip, 'me ka tataiso ea pono ea mochini, chip e behiloe ka nepo holim'a tlamahano. boemo ba foreime e etellang pele kapa substrate ea sephutheloana e koahetsoeng ka sekhomaretsi, 'me matla a itseng a tlamahano a lefu a sebelisoa ho chip ka hlooho ea mochini oa bonding, ho etsa lera la sekhomaretsi pakeng tsa chip le. foreimi e etellang pele kapa substrate ea sephutheloana, e le ho fihlela sepheo sa ho kopanya, ho kenya le ho lokisa chip. Mokhoa ona oa bonding o boetse o bitsoa glue bonding process hobane sekhomaretsi se hloka ho sebelisoa ka pel'a mochini o kopanyang oa die.
Likhomaretsi tse sebelisoang hangata li kenyelletsa lisebelisoa tsa semiconductor tse kang epoxy resin le conductive silver peste. Ho kopanya sekhomaretsi ke mokhoa o sebelisoang ka ho fetisisa oa semiconductor chip die bonding hobane mokhoa ona o batla o le bonolo, litšenyehelo li tlaase, 'me mefuta e fapaneng ea thepa e ka sebelisoa.
2.3 Mokhoa oa bonding oa Eutectic
Nakong ea tlamahano ea eutectic, thepa ea bonding ea eutectic hangata e sebelisoa esale pele ka tlase ho chip kapa foreimi e etellang pele. Thepa ea eutectic bonding e nka chip 'me e tataisoa ke mochine oa pono oa mochine ho beha ka nepo chip sebakeng se lumellanang sa ho kopanya foreimi e etellang pele. The chip le foreimi e etellang pele li theha sebopeho sa eutectic bonding lipakeng tsa chip le substrate ea sephutheloana tlas'a ketso e kopaneng ea ho futhumatsa le khatello. Mokhoa oa bonding oa eutectic o atisa ho sebelisoa ka foreimi ea lead le liphutheloana tsa ceramic substrate.
Lisebelisoa tsa bonding tsa Eutectic hangata li tsoakoa ke lisebelisoa tse peli ka mocheso o itseng. Lisebelisoa tse sebelisoang ka tloaelo li kenyelletsa khauta le thini, khauta le silicon, joalo-joalo Ha u sebelisa mokhoa oa eutectic bonding, mochine oa phetisetso ea pina moo foreimi e etellang pele e leng teng e tla futhumatsa foreimi pele. Senotlolo sa ho phethahala ha ts'ebetso ea eutectic bonding ke hore thepa ea eutectic bonding e ka qhibiliha ka mocheso o ka tlase ho ntlha ea ho qhibiliha ea lisebelisoa tse peli tse kopanetsoeng ho theha tlamo. E le ho thibela foreimi hore e se ke ea e-ba oxidized nakong ea ts'ebetso ea eutectic bonding, mokhoa oa ho kopanya li-eutectic hangata o sebelisa likhase tse sireletsang tse kang hydrogen le khase e tsoakiloeng ea naetrojene ho kenya letsoho pina ho sireletsa foreimi e etellang pele.
2. 4 Soft solder bonding process
Ha bonding e bonolo ea solder, pele u beha chip, boemo ba ho tlama holim'a foreimi e etellang pele bo koetsoe ebe bo hatelloa, kapa bo kenngoa habeli, 'me foreimi e etellang pele e hloka ho futhumatsoa ka pina. Molemo oa mokhoa o bonolo oa ho kopanya solder ke conductivity e ntle ea mocheso, 'me bothata ke hore ho bonolo ho oxidize mme mokhoa ona o batla o le thata. E loketse ho paka foreimi e etellang pele ea lisebelisoa tsa matla, joalo ka sephutheloana sa transistor outline.
2. 5 Silver sintering bonding process
Ts'ebetso e ts'episang ka ho fetesisa ea semiconductor chip ea morao-rao ea moloko oa boraro ke tšebeliso ea theknoloji ea tšepe ea sintering, e kopanyang li-polymers tse kang epoxy resin e ikarabellang bakeng sa ho hokahanya sekhomaretsing sa conductive. E na le conductivity e ntle ea motlakase, conductivity ea mocheso, le litšobotsi tsa tšebeletso ea mocheso o phahameng. Hape ke thekenoloji ea bohlokoa bakeng sa tsoelo-pele e eketsehileng ea ho paka semiconductor ea moloko oa boraro lilemong tsa morao tjena.
2.6 Thermocompression bonding process
Ts'ebetsong ea liphutheloana tsa li-circuits tse kopantsoeng tse nang le likarolo tse tharo tse sebetsang hantle, ka lebaka la phokotso e tsoelang pele ea chip interconnect input/output pitch, bump size le pitch, k'hamphani ea semiconductor ea Intel e phatlalalitse mokhoa oa ho kopanya thermocompression bakeng sa lits'ebetso tse tsoetseng pele tse nyane, tse kopanyang tse nyane. bump chips e nang le molumo oa 40 ho isa ho 50 μm kapa esita le 10 μm. Thermocompression bonding process e loketse lits'ebetso tsa chip-to-wafer le chip-to-substrate. E le ts'ebetso e potlakileng ea mehato e mengata, mokhoa oa ho kopanya thermocompression o tobana le mathata litabeng tsa taolo ea ts'ebetso, tse kang mocheso o sa lekaneng le ho qhibiliha ho sa laoleheng ha solder e nyenyane ea molumo. Nakong ea bonding ea thermocompression, mocheso, khatello, boemo, joalo-joalo li tlameha ho finyella litlhoko tse nepahetseng tsa taolo.
2.7 Mokhoa oa ho kopanya li-chip chip
Molao-motheo oa ts'ebetso ea ho kopanya li-flip chip o bontšoa ho Setšoantšo sa 2. Mochine oa flip o nka chip ho tloha sephakeng ebe o o fetola 180 ° ho fetisetsa chip. Nozzle ea hlooho ea solder e nka chip ho tloha mochining o phetholang, 'me moo chip e eang teng e leba tlase. Ka mor'a hore nozzle ea hlooho ea tjheseletsa e fetele ka holimo ho substrate ea ho paka, e theohela tlase ho tlama le ho lokisa chip holim'a substrate ea ho paka.
Flip chip packaging ke theknoloji e tsoetseng pele ea khokahano ea chip mme e fetohile tataiso e ka sehloohong ea nts'etsopele ea mahlale a tsoetseng pele a ho paka. E na le litšoaneleho tsa boleng bo phahameng, ts'ebetso e phahameng, e tšesaane ebile e khuts'oane, 'me e ka fihlela litlhoko tsa nts'etsopele ea lihlahisoa tsa elektronike tsa bareki tse kang li-smartphone le matlapa. Ts'ebetso ea bonding ea flip chip e etsa hore litšenyehelo tsa ho paka li theohe 'me li khone ho fumana li-chips tse pakiloeng le liphutheloana tse tharo. E sebelisoa haholo libakeng tsa theknoloji ea ho paka tse kang 2.5D/3D sephutheloana se kopaneng, sephutheloana sa wafer-level, le sephutheloana sa boemo ba sistimi. Ts'ebetso ea bonding ea flip chip ke mokhoa o sebelisoang ka ho fetesisa le o sebelisoang ka ho fetesisa o tiileng oa li-die bonding ho theknoloji e tsoetseng pele ea ho paka.
Nako ea poso: Nov-18-2024