Mokhoa oa ho etsa mehato ea ho sebetsa bakeng sa li-substrates tsa SiC ke tse latelang:
1. Crystal Orientation: Ho sebelisa X-ray diffraction ho lebisa kristale ingot.Ha sefate sa X-ray se lebisitsoe sefahlehong se lakatsehang sa kristale, lehlakoreng la lebone le fapaneng le lekanya hore na kristale e shebane le eng.
2. Outer Diameter Grinding: Likristale tse le 'ngoe tse hōlileng ka li-crucibles tsa graphite hangata li feta li-diameter tse tloaelehileng.Ho sila bophara ba ka ntle ho li fokotsa ho ea boholo bo tloaelehileng.
Ho Qetella Sefahleho: Li-substrates tsa 4-inch 4H-SiC hangata li na le mahlakore a mabeli a boemo, a mathomo le a bobeli.Ho sila sefahleho ho bula likarolo tsena tse emeng.
3. Wire Sawing: Ho sakha ka terata ke mohato oa bohlokoahali oa ho lokisa likaroloana tsa 4H-SiC.Mapetso le tšenyo e ka tlas'a lefatše e bakiloeng nakong ea terata e senya mekhoa e latelang, ho eketsa nako ea ts'ebetso le ho baka tahlehelo ea thepa.Mokhoa o atileng haholo ke ho sakha lithapo tse ngata tse nang le abrasive ea daemane.Motsamao o iphetang oa lithapo tsa tšepe tse kopantsoeng le li-abrasives tsa daemane li sebelisetsoa ho khaola ingot ea 4H-SiC.
4. Chamfering: Ho thibela ho phunyeha ha bohale le ho fokotsa tahlehelo e ka sebelisoang nakong ea ts'ebetso e latelang, likarolo tse bohale tsa li-chips tse entsoeng ka terata li hoheloa ka libopeho tse boletsoeng.
5. Ho sesa: Ho sakha ka terata ho siea mengoapo e mengata le tšenyo e ka tlas'a lefatše.Ho tšesa ho etsoa ka ho sebelisa mabili a taemane ho tlosa likoli tsena ka hohle kamoo ho ka khonehang.
6. Ho sila: Mokhoa ona o kenyelletsa ho sila ka thata le ho sila hantle ho sebelisa boron carbide ea boholo bo bonyenyane kapa li-abrasives tsa daemane ho tlosa tšenyo e setseng le tšenyo e ncha e hlahisoang nakong ea ho fokotsa.
7. Ho bentša: Mehato ea ho qetela e kenyelletsa ho bentša ho thata le ho bentša hantle ka ho sebelisa alumina kapa silicon oxide abrasives.Mokelikeli o benyang o nolofatsa bokaholimo, ebe o tlosoa ka mochine ka li-abrasives.Mohato ona o tiisa sebaka se boreleli le se sa senyeheng.
8. Ho Hloekisa: Ho tlosa likaroloana, litšepe, lifilimi tsa oxide, masala a manyolo, le litšila tse ling tse siiloeng mehatong ea ho sebetsa.
Nako ea poso: May-15-2024