Litaba tsa indasteri

  • Hobaneng ha Lisebelisoa tsa Semiconductor li Hloka "Epitaxial Layer"

    Hobaneng ha Lisebelisoa tsa Semiconductor li Hloka "Epitaxial Layer"

    Tšimoloho ea Lebitso "Epitaxial Wafer" Ho lokisoa ha Wafer ho na le mehato e 'meli e meholo: ho lokisetsa substrate le mokhoa oa epitaxial. The substrate e entsoe ka semiconductor single crystal material mme hangata e sebetswa ho hlahisa disebediswa tsa semiconductor. E ka boela ea etsa epitaxial pro...
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  • Silicon Nitride Ceramics ke eng?

    Silicon Nitride Ceramics ke eng?

    Silicon nitride (Si₃N₄) ceramics, joalo ka lirafshoa tsa meralo e tsoetseng pele, li na le thepa e ntle joalo ka ho hanyetsa mocheso o phahameng, matla a phahameng, ho tiea ho hoholo, boima bo phahameng, khanyetso ea creep, khanyetso ea oxidation, le ho hanyetsa ho roala. Ho feta moo, ba fana ka t...
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  • SK Siltron e fumana kalimo ea $ 544 milione ho tsoa ho DOE ho holisa tlhahiso ea silicon carbide wafer

    SK Siltron e fumana kalimo ea $ 544 milione ho tsoa ho DOE ho holisa tlhahiso ea silicon carbide wafer

    Lefapha la Matla la US (DOE) haufinyane le amohetse kalimo ea $ 544 milione (ho kenyeletsoa $481.5 milione ho sekolo le phaello ea $ 62.5 milione) ho SK Siltron, moetsi oa semiconductor oafer tlasa SK Group, ho ts'ehetsa katoloso ea eona ea silicon carbide ea boleng bo holimo (SiC). ...
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  • Sistimi ea ALD ke eng (Atomic Layer Deposition)

    Sistimi ea ALD ke eng (Atomic Layer Deposition)

    Li-Susceptors tsa Semicera ALD: Ho nolofalletsa Boemo ba Atomic Layer ka Precision and Reliability Atomic Layer Deposition (ALD) ke mokhoa o tsoetseng pele o fanang ka ho nepahala ha tekanyo ea athomo bakeng sa ho kenya lifilimi tse tšesaane liindastering tse fapaneng tsa theknoloji e phahameng, ho kenyeletsoa lisebelisoa tsa elektroniki, matla,...
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  • Qetellong ea Mola (FEOL): Ho Theha Motheo

    Qetellong ea Mola (FEOL): Ho Theha Motheo

    Karolo e ka pele, e bohareng le e ka morao ea mela ea tlhahiso ea semiconductor Mokhoa oa ho etsa semiconductor o ka aroloa ka mekhahlelo e meraro: 1) Qetello e ka pele ea mohala2) Qetellong ea mola3) Karolo e ka morao ea mohala Re ka sebelisa papiso e bonolo joalo ka ho aha ntlo. ho hlahloba mokhoa o rarahaneng ...
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  • Puisano e khutšoanyane mabapi le mokhoa oa ho roala photoresist

    Puisano e khutšoanyane mabapi le mokhoa oa ho roala photoresist

    Mekhoa ea ho roala ea photoresist ka kakaretso e arotsoe ka ho roala ha spin, dip coating le roll coating, eo har'a eona ho sebelisoang haholo ho roala ha spinal. Ka ho roala ha spin, photoresist e rotha holim'a substrate, 'me substrate e ka fetoloa ka lebelo le phahameng ho fumana ...
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  • Photoresist: thepa ea mantlha e nang le litšitiso tse phahameng tsa ho kena bakeng sa li-semiconductors

    Photoresist: thepa ea mantlha e nang le litšitiso tse phahameng tsa ho kena bakeng sa li-semiconductors

    Hona joale Photoresist e sebelisoa haholo ho sebetsa le ho hlahisa li-circuits tse ntle tsa litšoantšo indastering ea tlhahisoleseling ea optoelectronic. Litsenyehelo tsa ts'ebetso ea photolithography li etsa hoo e ka bang 35% ea ts'ebetso eohle ea tlhahiso ea li-chip, 'me nako ea tšebeliso ea nako e nka 40% ho isa ho 60 ...
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  • Tšilafalo ea bokaholimo le mokhoa oa ho lemoha

    Tšilafalo ea bokaholimo le mokhoa oa ho lemoha

    Bohloeki ba bokaholimo bo tla ama haholo sekhahla sa ho tšoaneleha sa lits'ebetso le lihlahisoa tse latelang tsa semiconductor. Ho fihla ho 50% ea litahlehelo tsohle tsa lihlahisoa li bakoa ke tšilafalo ea bokaholimo. Lintho tse ka bakang liphetoho tse sa laoleheng sebakeng sa motlakase ...
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  • Lipatlisiso mabapi le ts'ebetso ea bonding ea semiconductor die bonding le lisebelisoa

    Lipatlisiso mabapi le ts'ebetso ea bonding ea semiconductor die bonding le lisebelisoa

    Ho ithuta ka semiconductor die bonding process, ho kenyeletsoa ts'ebetso ea li-adhesive bonding, eutectic bonding process, soft solder bonding process, silver sintering bonding process, hot pressing bonding process, flip chip bonding process. Mefuta le matšoao a bohlokoa a tekheniki ...
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  • Ithute ka silicon ka (TSV) le ka khalase ka theknoloji ea (TGV) sehloohong se le seng

    Ithute ka silicon ka (TSV) le ka khalase ka theknoloji ea (TGV) sehloohong se le seng

    Theknoloji ea ho paka ke e 'ngoe ea lits'ebetso tsa bohlokoahali indastering ea semiconductor. Ho latela sebopeho sa sephutheloana, e ka aroloa ka sephutheloana sa socket, sephutheloana sa holim'a metsi, sephutheloana sa BGA, sephutheloana sa boholo ba chip (CSP), sephutheloana sa single chip module (SCM, lekhalo lipakeng tsa wiring ho ...
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  • Tlhahiso ea Chip: Thepa ea Etching le Ts'ebetso

    Tlhahiso ea Chip: Thepa ea Etching le Ts'ebetso

    Ts'ebetsong ea tlhahiso ea semiconductor, theknoloji ea etching ke ts'ebetso ea bohlokoa e sebelisoang ho tlosa ka nepo lisebelisoa tse sa batleheng ho substrate ho theha lipaterone tse rarahaneng tsa potoloho. Sengoliloeng sena se tla hlahisa mahlale a mabeli a mantlha a etching ka botlalo - plasma e kopantsoeng ka matla ...
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  • Ts'ebetso e qaqileng ea tlhahiso ea silicon wafer semiconductor

    Ts'ebetso e qaqileng ea tlhahiso ea silicon wafer semiconductor

    Ntlha ea pele, kenya silicon ea polycrystalline le li-dopants ka har'a crucible ea quartz ka sebōping se le seng sa kristale, phahamisa mocheso ho feta likhato tse 1000, 'me u fumane silicon ea polycrystalline sebakeng se qhibilihisitsoeng. Silicon ingot kholo ke mokhoa oa ho etsa silicon ea polycrystalline hore e be kristale e le 'ngoe ...
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