Semicerake motlotlo ho hlahisa the30mm Aluminium Nitride Wafer Substrate, thepa ea boemo bo holimo e etselitsoeng ho fihlela litlhoko tse thata tsa lisebelisoa tsa sejoale-joale tsa elektroniki le tsa optoelectronic. Li-substrates tsa Aluminium Nitride (AlN) li tsebahala ka ho tsamaisa mocheso le thepa ea ho kenya motlakase, e leng se etsang hore e be khetho e nepahetseng bakeng sa lisebelisoa tse sebetsang hantle haholo.
Likarolo tsa Bohlokoa:
• E ikhethang Thermal Conductivity: The30mm Aluminium Nitride Wafer Substratee ithorisa ka conductivity ea mocheso e fihlang ho 170 W / mK, e phahameng haholo ho feta lisebelisoa tse ling tsa substrate, e netefatsang hore ho na le mocheso o sebetsang hantle oa mocheso lits'ebetsong tsa matla a phahameng.
•Insulation e Phahameng ea Motlakase: Ka thepa e ntle haholo ea ho sireletsa motlakase, substrate ena e fokotsa tšitiso ea lipuisano le lipontšo, e etsa hore e be e loketseng bakeng sa lisebelisoa tsa RF le microwave.
•Matla a Mechini: The30mm Aluminium Nitride Wafer Substratee fana ka matla a phahameng a mochine le botsitso, ho netefatsa ho tšoarella le ho tšepahala esita le tlas'a maemo a thata a ho sebetsa.
•Lisebelisoa tse fapaneng: Substrate ena e nepahetse bakeng sa tšebeliso ea li-LED tsa matla a holimo, li-laser diode, le likarolo tsa RF, e fana ka motheo o tiileng le o tšepahalang bakeng sa merero ea hau e batloang haholo.
•Precision Fabrication: Semicera e etsa bonnete ba hore karolo e 'ngoe le e' ngoe ea li-wafer e entsoe ka mokhoa o nepahetseng ka ho fetisisa, e fanang ka botenya bo lekanang le boleng ba holim'a metsi ho finyella litekanyetso tse nepahetseng tsa lisebelisoa tsa elektronike tse tsoetseng pele.
Ntlafatsa ts'ebetso le ts'epahalo ea lisebelisoa tsa hau ka Semicera's30mm Aluminium Nitride Wafer Substrate. Li-substrates tsa rona li etselitsoe ho fana ka ts'ebetso e phahameng, ho netefatsa hore lisebelisoa tsa hau tsa elektroniki le tsa optoelectronic li sebetsa ka hohle kamoo li ka khonang. Tšepa Semicera bakeng sa lisebelisoa tsa morao-rao tse etellang indasteri pele ka boleng le boqapi.
Lintho | Tlhahiso | Patlisiso | Dummy |
Crystal Parameters | |||
Polytype | 4H | ||
Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
Litekanyetso tsa Motlakase | |||
Dopant | n-mofuta oa Nitrojene | ||
Ho hanyetsa | 0.015-0.025ohm · cm | ||
Mechanical Parameters | |||
Diameter | 150.0±0.2mm | ||
Botenya | 350±25 μm | ||
Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
Folete ea bobeli | Ha ho letho | ||
TTV | ≤5 μm | ≤10 μm | ≤15 μm |
LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
Warp | ≤35 μm | ≤45 μm | ≤55 μm |
Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
Sebopeho | |||
Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
Boleng ba Pele | |||
Pele | Si | ||
Qetello ea bokaholimo | Si-face CMP | ||
Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
Ho tšoaea ka laser ka pele | Ha ho letho | ||
Boleng ba Morao | |||
Qetello ea morao | C-sefahleho sa CMP | ||
Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
Qetello | |||
Qetello | Chamfer | ||
Sephutheloana | |||
Sephutheloana | Epi e loketse ho paka ka vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
*Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. |