Semicera's 4", 6", le 8" N-type SiC Ingots e emela katleho ea thepa ea semiconductor, e etselitsoeng ho finyella litlhoko tse ntseng li eketseha tsa lisebelisoa tsa morao-rao tsa elektronike le matla. tshebetso le bophelo bo bolelele.
Li-ingots tsa rona tsa mofuta oa N-SiC li hlahisoa ka mekhoa e tsoetseng pele ea tlhahiso e matlafatsang tsamaiso ea bona ea motlakase le botsitso ba mocheso. Sena se etsa hore e be tse loketseng bakeng sa lits'ebetso tsa matla a holimo le a maqhubu a phahameng, joalo ka li-inverters, li-transistors, le lisebelisoa tse ling tsa elektroniki moo ho sebetsa hantle le ho ts'epahala ho tlang pele.
Doping e nepahetseng ea li-ingots tsena e netefatsa hore li fana ka ts'ebetso e tsitsitseng le e phetoang. Ho tsitsana hona ho bohlokoa bakeng sa bahlahisi le bahlahisi ba sutumetsang meeli ea theknoloji mafapheng a kang sefofane, likoloi le likhokahano tsa mehala. Li-ingots tsa SiC tsa Semicera li nolofalletsa tlhahiso ea lisebelisoa tse sebetsang hantle tlas'a maemo a feteletseng.
Ho khetha Semicera's N-type SiC Ingots ho bolela ho kopanya lisebelisoa tse khonang ho sebetsana le mocheso o phahameng le meroalo e phahameng ea motlakase habonolo. Li-ingots tsena li loketse ka ho khetheha bakeng sa ho theha likarolo tse hlokang taolo e ntle ea mocheso le ts'ebetso ea maqhubu a phahameng, joalo ka li-amplifiers tsa RF le li-module tsa motlakase.
Ka ho khetha Semicera's 4", 6", le 8" N-type SiC Ingots, u tsetela ho sehlahisoa se kopanyang thepa e ikhethang ka ho nepahala le ho ts'epahala ho hlokoang ke mahlale a morao-rao a semiconductor. Semicera e ntse e tsoela pele ho etella indasteri pele ho fana ka litharollo tse ncha tse tsamaisang tsoelopele ea tlhahiso ea lisebelisoa tsa elektroniki.
| Lintho | Tlhahiso | Patlisiso | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Phoso ea sebopeho sa bokaholimo | <11-20>4±0.15° | ||
| Litekanyetso tsa Motlakase | |||
| Dopant | n-mofuta oa Nitrojene | ||
| Ho hanyetsa | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Botenya | 350±25 μm | ||
| Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
| Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
| Folete ea bobeli | Ha ho letho | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Sebopeho | |||
| Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
| Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Boleng ba Pele | |||
| Pele | Si | ||
| Qetello ea bokaholimo | Si-face CMP | ||
| Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
| Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
| Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
| Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
| Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
| Ho tšoaea ka laser ka pele | Ha ho letho | ||
| Boleng ba Morao | |||
| Qetello ea morao | C-sefahleho sa CMP | ||
| Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
| Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
| Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
| Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
| Qetello | |||
| Qetello | Chamfer | ||
| Sephutheloana | |||
| Sephutheloana | Epi e loketse ho paka ka vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
| *Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. | |||
