4 Inch SiC Substrate N-mofuta

Tlhaloso e Khutšoanyane:

Semicera e fana ka mefuta e mengata ea li-wafers tsa 4H-8H SiC. Ka lilemo tse ngata, re bile moetsi le mofani oa lihlahisoa ho liindasteri tsa semiconductor le photovoltaic. Lihlahisoa tsa rona tsa mantlha li kenyelletsa: lipoleiti tsa silicon carbide etch, li-trailer tsa silicon carbide boat, likepe tsa silicon carbide wafer (PV & Semiconductor), li-tubes tsa silicon carbide furnace, silicon carbide cantilever paddles, silicon carbide chucks, silicon carbide libalaka, hammoho le CVD SiC coatings. Liaparo tsa TaC. E akaretsa boholo ba limmaraka tsa Europe le Amerika. Re labalabela ho ba molekane oa hau oa nako e telele Chaena.

 

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

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Silicon carbide (SiC) thepa e le 'ngoe ea kristale e na le lekhalo le leholo la lekhalo la sehlopha (~ Si makhetlo a 3), conductivity e phahameng ea mocheso (~Si 3.3 linako kapa GaAs makhetlo a 10), tekanyo e phahameng ea ho falla ha elektronike (~ Si 2.5 linako), ho senyeha ho matla ha motlakase tšimo (~ Si 10 linako kapa GaAs 5 linako) le litšobotsi tse ling tse hlaheletseng.

Matla a Semicera a ka fana ka bareki ba boleng bo phahameng ba Conductive (Conductive), Semi-insulating (Semi-insulating), HPSI (High Purity semi-insulating) silicon carbide substrate; Ho phaella moo, re ka fana ka bareki ba nang le homogeneous le heterogeneous silicon carbide epitaxial sheets; Re ka boela ra iketsetsa leqephe la epitaxial ho latela litlhoko tse khethehileng tsa bareki, 'me ha ho na palo e fokolang ea taelo.

Lintho

Tlhahiso

Patlisiso

Dummy

Crystal Parameters

Polytype

4H

Phoso ea ho shebana le bokaholimo

<11-20>4±0.15°

Litekanyetso tsa Motlakase

Dopant

n-mofuta oa Nitrojene

Ho hanyetsa

0.015-0.025ohm · cm

Mechanical Parameters

Diameter

99.5 - 100 limilimithara

Botenya

350±25 μm

Boemo ba mantlha bo bataletseng

[1-100]±5°

Bolelele ba pele bo bataletseng

32.5±1.5mm

Boemo ba bobeli bo bataletseng

90 ° CW ho tloha foleteng ea mantlha ± 5 °. silicon e shebile holimo

Bolelele ba bobeli bo bataletseng

18±1.5mm

TTV

≤5 μm

≤10 μm

≤20 μm

LTV

≤2 μm(5mm*5mm)

≤5 μm(5mm*5mm)

NA

Inamela

-15μm ~ 15μm

-35μm ~ 35μm

-45μm ~ 45μm

Warp

≤20 μm

≤45 μm

≤50 μm

Front(Si-face) roughness(AFM)

Ra≤0.2nm (5μm*5μm)

Sebopeho

Boima ba micropipe

≤1 e/cm2

≤5 ea/cm2

≤10 ea/cm2

Litšila tsa tšepe

≤5E10atoms/cm2

NA

BPD

≤1500 ea/cm2

≤3000 ea/cm2

NA

TSD

≤500 ea/cm2

≤1000 ea/cm2

NA

Boleng ba Pele

Pele

Si

Qetello ea bokaholimo

Si-face CMP

Likaroloana

≤60ea/wafer (boholo ≥0.3μm)

NA

Mengwapo

≤2ea/mm. Bolelele ba kakaretso ≤Diameter

Bolelele bo akaretsang≤2*Diameter

NA

Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso

Ha ho letho

NA

Li-edge chips/indents/fracture/hex plates

Ha ho letho

NA

Libaka tsa polytype

Ha ho letho

Kakaretso≤20%

Kakaretso≤30%

Ho tšoaea ka laser ka pele

Ha ho letho

Boleng ba Morao

Qetello ea morao

C-sefahleho sa CMP

Mengwapo

≤5ea/mm, bolelele bo akaretsang≤2* bophara

NA

Litšitiso tse ka morao (li-chips / indents)

Ha ho letho

Bokhopo ba mokokotlo

Ra≤0.2nm (5μm*5μm)

Ho tšoaea ka morao laser

1 mm (ho tloha pheletsong e ka holimo)

Qetello

Qetello

Chamfer

Sephutheloana

Sephutheloana

Mokotla o ka hare o tlatsitsoe ka naetrojene 'me mokotla o ka ntle oa tlosoa.

Multi-wafer cassette, epi-ready.

*Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD.

Li-wafers tsa SiC

Semicera Sebaka sa mosebetsi Sebaka sa mosebetsi sa Semicera 2 Mochini oa lisebelisoa Ts'ebetso ea CNN, ho hloekisa lik'hemik'hale, ho roala CVD Tshebeletso ya rona


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