Semicera's 6 Inch N-type SiC Wafer e eme ka pele ho theknoloji ea semiconductor. E entsoe bakeng sa ts'ebetso e nepahetseng, sephaphatha sena se ipabola ka ho sebelisa matla a holimo, maqhubu a holimo le mocheso o phahameng, se bohlokoa bakeng sa lisebelisoa tse tsoetseng pele tsa elektroniki.
Sephepana sa rona sa 6 Inch N-mofuta oa SiC se na le motsamao o phahameng oa elektronike le ho hanyetsa ho fokolang, e leng litekanyetso tsa bohlokoa bakeng sa lisebelisoa tsa motlakase tse kang MOSFET, diode le likarolo tse ling. Thepa ena e netefatsa phetoho e sebetsang ea matla le ho fokotsa mocheso oa mocheso, ho matlafatsa ts'ebetso le nako ea bophelo ea lisebelisoa tsa elektronike.
Ts'ebetso e matla ea taolo ea boleng ba Semicera e netefatsa hore sephaphatha se seng le se seng sa SiC se boloka bokhabane bo holimo le bofokoli bo fokolang. Tlhokomelo ena e hlokolosi ea lintlha e netefatsa hore li-wafers tsa rona li fihlela litlhoko tse thata tsa liindasteri tse kang tsa makoloi, sefofane le likhokahano tsa mehala.
Ntle le thepa ea eona e phahameng ea motlakase, sephaphatha sa SiC sa mofuta oa N se fana ka botsitso bo matla ba mocheso le ho hanyetsa mocheso o phahameng, e leng se etsang hore e be se loketseng libakeng tseo lisebelisoa tse tloaelehileng li ka hlolehang ho tsona. Bokhoni bona bo bohlokoa haholo lits'ebetsong tse amanang le ts'ebetso ea maqhubu a holimo le a matla a phahameng.
Ka ho khetha Semicera's 6 Inch N-type SiC Wafer, u tsetela ho sehlahisoa se emelang tlhōrō ea boqapi ba semiconductor. Re ikemiseditse ho fana ka diboloko tsa ho aha disebediswa tsa moraorao, ho netefatsa hore balekane ba rona diindastering tse fapaneng ba fihlella disebediswa tse molemo ka ho fetisisa bakeng sa ntshetsopele ya bona ya thekenoloji.
| Lintho | Tlhahiso | Patlisiso | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
| Litekanyetso tsa Motlakase | |||
| Dopant | n-mofuta oa Nitrojene | ||
| Ho hanyetsa | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Botenya | 350±25 μm | ||
| Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
| Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
| Folete ea bobeli | Ha ho letho | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Sebopeho | |||
| Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
| Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Boleng ba Pele | |||
| Pele | Si | ||
| Qetello ea bokaholimo | Si-face CMP | ||
| Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
| Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
| Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
| Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
| Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
| Ho tšoaea ka laser ka pele | Ha ho letho | ||
| Boleng ba Morao | |||
| Qetello ea morao | C-sefahleho sa CMP | ||
| Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
| Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
| Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
| Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
| Qetello | |||
| Qetello | Chamfer | ||
| Sephutheloana | |||
| Sephutheloana | Epi e loketse ho paka ka vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
| *Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. | |||
