Semicera's 6 Inch Semi-Insulating HPSI SiC Wafers e etselitsoe ho fihlela litlhoko tse matla tsa theknoloji ea semiconductor ea sejoale-joale. Ka bohloeki bo ikhethang le botsitso, li-wafers tsena li sebetsa e le motheo o ka tšeptjoang oa ho theha lisebelisoa tsa elektronike tse sebetsang hantle haholo.
Li-wafers tsena tsa HPSI SiC li tsebahala ka mokhoa oa tsona oa ho tsamaisa mocheso le ho kenya motlakase, tse bohlokoa bakeng sa ho ntlafatsa ts'ebetso ea lisebelisoa tsa motlakase le li-circuits tse phahameng haholo. Thepa ea semi-insulating e thusa ho fokotsa tšitiso ea motlakase le ho ntlafatsa ts'ebetso ea sesebelisoa.
Ts'ebetso ea boleng bo holimo e sebelisoang ke Semicera e netefatsa hore sephaphatha se seng le se seng se na le botenya bo lekanang le bofokoli bo fokolang ba bokaholimo. Ho nepahala hona ho bohlokoa bakeng sa lits'ebetso tse tsoetseng pele joalo ka lisebelisoa tsa maqhubu a seea-le-moea, li-inverters tsa motlakase, le lisebelisoa tsa LED, moo ts'ebetso le nako e telele e leng lintlha tsa bohlokoa.
Ka ho sebelisa mekhoa ea morao-rao ea tlhahiso ea lihlahisoa, Semicera e fana ka li-wafers tse sa kopaneng feela empa li feta litekanyetso tsa indasteri. Boholo ba 6-inch bo fana ka phetoho ea ho eketsa tlhahiso, ho sebetsana le lipatlisiso le likopo tsa khoebo lefapheng la semiconductor.
Ho khetha Semicera's 6 Inch Semi-Insulating HPSI SiC Wafers ho bolela ho tsetela ho sehlahisoa se fanang ka boleng le ts'ebetso e tsitsitseng. Li-wafer tsena ke karolo ea boitlamo ba Semicera ba ho ntšetsa pele bokhoni ba theknoloji ea semiconductor ka lisebelisoa tse ncha le boqapi bo hlokolosi.
| Lintho | Tlhahiso | Patlisiso | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
| Litekanyetso tsa Motlakase | |||
| Dopant | n-mofuta oa Nitrojene | ||
| Ho hanyetsa | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Botenya | 350±25 μm | ||
| Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
| Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
| Folete ea bobeli | Ha ho letho | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Sebopeho | |||
| Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
| Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Boleng ba Pele | |||
| Pele | Si | ||
| Qetello ea bokaholimo | Si-face CMP | ||
| Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
| Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
| Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
| Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
| Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
| Ho tšoaea ka laser ka pele | Ha ho letho | ||
| Boleng ba Morao | |||
| Qetello ea morao | C-sefahleho sa CMP | ||
| Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
| Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
| Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
| Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
| Qetello | |||
| Qetello | Chamfer | ||
| Sephutheloana | |||
| Sephutheloana | Epi-reading ka sephutheloana sa vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
| *Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. | |||
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