Kenyelletso ea Silicon Carbide Coating
Liaparo tsa rona tsa Chemical Vapor Deposition (CVD) Silicon Carbide (SiC) ke lera le tšoarellang haholo ebile le sa senyehe, le loketseng tikoloho e hlokang ho bola ho hoholo le ho hanyetsa mocheso.Ho roala silicon Carbidee sebelisoa ka likarolo tse tšesaane ho li-substrates tse fapaneng ka ts'ebetso ea CVD, e fanang ka litšobotsi tse phahameng tsa ts'ebetso.
Likarolo tsa Bohlokoa
● -Bohloeki bo ikhethang: Ho ithorisa ka sebopeho se hloekileng haholo sa99.99995%, ronaHo roala ha SiCe fokotsa likotsi tsa tšoaetso ts'ebetsong e hlokolosi ea semiconductor.
● -Bohanyetsi bo Phahameng: E bonts'a khanyetso e ntle ka ho fetesisa le ho bola, e etsa hore e be e loketseng bakeng sa litlhophiso tse thata tsa lik'hemik'hale le plasma.
● -High Thermal Conductivity: E netefatsa ts'ebetso e tšepahalang tlas'a mocheso o feteletseng ka lebaka la thepa ea eona e ikhethang ea mocheso.
● -Botsitso ba Dimensional: E boloka botšepehi ba sebopeho ho pholletsa le mefuta e mengata ea mocheso, ka lebaka la coefficient ea eona e tlaase ea katoloso ea mocheso.
● -Bothata bo Matlafalitsoeng: Ka boima bo boholo ba40 GPA, seaparo sa rona sa SiC se mamella tšusumetso e kholo le ho senya.
● -Smooth Surface Qetella: E fana ka sephetho se kang seipone, se fokotsa tlhahiso ea likaroloana le ho ntlafatsa ts'ebetso ea ts'ebetso.
Lisebelisoa
Semicera Liaparo tsa SiCli sebelisoa ka mekhahlelo e fapaneng ea tlhahiso ea semiconductor, ho kenyelletsa:
● -Tlhahiso ea Chip ea LED
● -Tlhahiso ea Polysilicon
● -Khōlo ea Crystal ea Semiconductor
● -Silicon le SiC Epitaxy
● -Thermal Oxidation and Diffusion (TO&D)
Re fana ka lisebelisoa tse koahetsoeng ka SiC tse entsoeng ka matla a phahameng a isostatic graphite, carbon fiber-reinforced carbon le 4N recrystallized silicon carbide, e etselitsoeng li-reactors-bed reactors,Li-converter tsa STC-TCS, CZ unit reflectors, sekepe sa SiC wafer, SiCwafer paddle, SiC wafer tube, le li-wafer carriers tse sebelisoang ho PECVD, silicon epitaxy, MOCVD process..
Melemo
● -Bophelo bo Atolositsoeng: E fokotsa haholo nako ea ho fokotsa nako ea lisebelisoa le litšenyehelo tsa tlhokomelo, ho matlafatsa katleho ea tlhahiso ka kakaretso.
● -Boleng bo Ntlafetseng: E fihlella libaka tse hloekileng tse hlokahalang bakeng sa ts'ebetso ea semiconductor, ka hona e matlafatsa boleng ba sehlahisoa.
● -Keketseho ea Bokhoni: E ntlafatsa mekhoa ea mocheso le ea CVD, e bakang linako tse khutšoanyane tsa potoloho le lihlahisoa tse phahameng.
Litlhaloso tsa Tekheniki
● -Sebopeho: FCC β phase polycrystaline, haholo-holo (111) e sekametseng
● -Tekano3.21 g/cm³
● -Bothata: boima ba 2500 Vickes (moroalo oa 500g)
● -Ho thatafala ha Letsoho: 3.0 MPa·m1/2
● -Katoloso ea Thermal Coefficient (100–600 °C): 4.3 x 10-6k-1
● -Elastic Modulus(1300 ℃):435 GPA
● -Tlhaloso ea Botenya ba Filimi:100µm
● -Bokhopo ba Bokaholimo:2-10 µm
Purity Data (E lekantsoe ka Glow Discharge Mass Spectroscopy)
| Element | ppm | Element | ppm |
| Li | <0.001 | Cu | <0.01 |
| Be | <0.001 | Zn | <0.05 |
| Al | <0.04 | Ga | <0.01 |
| P | <0.01 | Ge | <0.05 |
| S | <0.04 | As | <0.005 |
| K | <0.05 | In | <0.01 |
| Ca | <0.05 | Sn | <0.01 |
| Ti | <0.005 | Sb | <0.01 |
| V | <0.001 | W | <0.05 |
| Cr | <0.05 | Te | <0.01 |
| Mn | <0.005 | Pb | <0.01 |
| Fe | <0.05 | Bi | <0.05 |
| Ni | <0.01 |
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