Semicera's LiNbO3 Bonding Wafer e etselitsoe ho fihlela litlhoko tse phahameng tsa tlhahiso e tsoetseng pele ea semiconductor. Ka thepa ea eona e ikhethang, e kenyelletsang ho hanyetsa ho apara ka mokhoa o phahameng, botsitso bo phahameng ba mocheso, le bohloeki bo ikhethang, sephaphatha sena se loketse ho sebelisoa lits'ebetsong tse hlokang ts'ebetso e nepahetseng le e tšoarellang nako e telele.
Lefapheng la semiconductor, LiNbO3 Bonding Wafers hangata li sebelisoa bakeng sa ho kopanya likarolo tse tšesaane ho lisebelisoa tsa optoelectronic, li-sensor le li-IC tse tsoetseng pele. Li bohlokoa ka ho khetheha ho photonics le MEMS (Micro-Electromechanical Systems) ka lebaka la thepa ea bona e babatsehang ea dielectric le bokhoni ba ho mamella maemo a thata a ts'ebetso. Semicera's LiNbO3 Bonding Wafer e etselitsoe ho ts'ehetsa maqhama a nepahetseng, ho ntlafatsa ts'ebetso le ts'epahalo ea lisebelisoa tsa semiconductor.
Thermal le thepa ea motlakase ea LiNbO3 | |
Sebaka se qhibilihang | 1250 ℃ |
Mocheso oa curie | 1140 ℃ |
Thermal conductivity | 38 W/m/K @ 25 ℃ |
Coefficient ea katoloso ea mocheso (@ 25°C) | //a, 2.0×10-6/K //c, 2.2×10-6/K |
Ho hanyetsa | 2×10-6Ω·cm @ 200 ℃ |
Dielectric kamehla | εS11/ε0=43, εT11/ε0=78 εS33/ε0=28, εT33/ε0= 2 |
Piezoelectric kamehla | D22=2.04×10-11C/N D33=19.22×10-11C/N |
Electro-optic coefficient | γT33=32 pm/V, γS33=31 pm/V, γT31=10 pm/V, γS31=8.6 pm/V, γT22=6.8 pm/V, γS22=3.4 pm/V, |
Half-wave voltage, DC | 3.03 KV 4.02 KV |
E entsoe ka thepa ea boleng bo holimo, LiNbO3 Bonding Wafer e netefatsa ho ts'epahala ho ts'epahalang le tlas'a maemo a feteletseng. Botsitso ba eona bo phahameng ba mocheso bo etsa hore e tšoanelehe ka ho khetheha bakeng sa libaka tse amanang le mocheso o phahameng, joalo ka tse fumanoang lits'ebetsong tsa semiconductor epitaxy. Ntle le moo, bohloeki bo phahameng ba semiconductor bo netefatsa tšilafalo e fokolang, e leng se etsang hore e be khetho e tšepahalang bakeng sa lits'ebetso tsa bohlokoa tsa semiconductor.
Ho Semicera, re ikemiselitse ho fana ka litharollo tse etellang pele indastering. LiNbO3 Bonding Wafer ea rona e fana ka ts'ebetso e tšoarellang e ke keng ea lekanngoa le bokhoni ba ts'ebetso e phahameng bakeng sa lits'ebetso tse hlokang bohloeki bo phahameng, ho hanyetsa ho roala, le botsitso ba mocheso. Ebang ke bakeng sa tlhahiso e tsoetseng pele ea semiconductor kapa mahlale a mang a ikhethang, sephaphatha sena se sebetsa e le karolo ea bohlokoa bakeng sa tlhahiso ea lisebelisoa tse tsoetseng pele.