Semicera's P-type SiC Substrate Wafer ke karolo ea bohlokoa bakeng sa ho nts'etsapele lisebelisoa tse tsoetseng pele tsa elektroniki le tsa optoelectronic. Li-wafers tsena li etselitsoe ho fana ka ts'ebetso e ntlafalitsoeng libakeng tse matla a phahameng le mocheso o phahameng, ho ts'ehetsa tlhokahalo e ntseng e hola ea likarolo tse sebetsang hantle le tse tšoarellang.
Doping ea mofuta oa P ka har'a li-wafers tsa rona tsa SiC e etsa bonnete ba hore ts'ebetso ea motlakase e ntlafala le motsamao o tsamaisang thepa. Sena se etsa hore li tšoanelehe ka ho khetheha bakeng sa lits'ebetso tsa elektronike tsa matla, li-LED, le lisele tsa photovoltaic, moo tahlehelo ea matla a tlaase le katleho e phahameng e leng tsa bohlokoa.
E entsoe ka litekanyetso tse phahameng ka ho fetisisa tsa ho nepahala le boleng, li-wafers tsa Semicera tsa P-type SiC li fana ka ts'ebetso e ntle ea holimo le litekanyetso tse fokolang tsa bokooa. Litšobotsi tsena li bohlokoa liindastering moo ho ts'epahala le ho ts'epahala ho hlokahalang, joalo ka mafapha a sefofane, a likoloi le a matla a ka nchafatsoang.
Boitlamo ba Semicera ho boqapi le bokhabane bo bonahala ho P-mofuta oa rona oa SiC Substrate Wafer. Ka ho kenyelletsa li-wafers tsena ts'ebetsong ea hau ea tlhahiso, u etsa bonnete ba hore lisebelisoa tsa hau li rua molemo ho tsoa mefuteng e ikhethang ea mocheso le ea motlakase ea SiC, e li nolofalletsang ho sebetsa ka katleho tlas'a maemo a thata.
Ho tsetela ho Semicera's P-type SiC Substrate Wafer ho bolela ho khetha sehlahisoa se kopanyang mahlale a mahlale a morao-rao le boenjiniere bo hlokolosi. Semicera e ikemiselitse ho ts'ehetsa moloko o latelang oa theknoloji ea elektroniki le ea optoelectronic, e fana ka likarolo tsa bohlokoa tse hlokahalang bakeng sa katleho ea hau indastering ea semiconductor.
| Lintho | Tlhahiso | Patlisiso | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
| Litekanyetso tsa Motlakase | |||
| Dopant | n-mofuta oa Nitrojene | ||
| Ho hanyetsa | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Botenya | 350±25 μm | ||
| Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
| Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
| Folete ea bobeli | Ha ho letho | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Sebopeho | |||
| Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
| Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Boleng ba Pele | |||
| Pele | Si | ||
| Qetello ea bokaholimo | Si-face CMP | ||
| Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
| Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
| Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
| Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
| Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
| Ho tšoaea ka laser ka pele | Ha ho letho | ||
| Boleng ba Morao | |||
| Qetello ea morao | C-sefahleho sa CMP | ||
| Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
| Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
| Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
| Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
| Qetello | |||
| Qetello | Chamfer | ||
| Sephutheloana | |||
| Sephutheloana | Epi e loketse ho paka ka vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
| *Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. | |||
