P-mofuta oa SiC Substrate Wafer

Tlhaloso e Khutšoanyane:

Semicera's P-type SiC Substrate Wafer e etselitsoe lisebelisoa tse phahameng tsa elektroniki le tsa optoelectronic. Li-wafers tsena li fana ka conductivity e ikhethang le botsitso ba mocheso, e leng se etsang hore e be tse loketseng lisebelisoa tse sebetsang hantle. Ka Semicera, lebella ho nepahala le ho ts'epahala ho li-wafers tsa hau tsa P-type SiC substrate.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Semicera's P-type SiC Substrate Wafer ke karolo ea bohlokoa bakeng sa ho nts'etsapele lisebelisoa tse tsoetseng pele tsa elektroniki le tsa optoelectronic. Li-wafers tsena li etselitsoe ho fana ka ts'ebetso e ntlafalitsoeng libakeng tse matla le mocheso o phahameng, ho ts'ehetsa tlhokahalo e ntseng e hola ea likarolo tse sebetsang hantle le tse tšoarellang.

Doping ea mofuta oa P ka har'a li-wafers tsa rona tsa SiC e netefatsa ho ntlafala ha motlakase le motsamao oa sepalangoang sa litefiso. Sena se etsa hore li tšoanelehe ka ho khetheha bakeng sa lits'ebetso tsa elektronike ea matla, li-LED, le lisele tsa photovoltaic, moo tahlehelo ea matla a tlaase le ts'ebetso e phahameng e leng ea bohlokoa.

E entsoe ka litekanyetso tse phahameng ka ho fetisisa tsa ho nepahala le boleng, li-wafers tsa Semicera tsa P-type SiC li fana ka ts'ebetso e ntle ea holimo le litekanyetso tse fokolang tse fokolang. Litšobotsi tsena li bohlokoa liindastering moo ho ts'epahala le ho ts'epahala ho leng bohlokoa, joalo ka mafapha a sefofane, a likoloi le a matla a ka nchafatsoang.

Boitlamo ba Semicera ho boqapi le bokhabane bo bonahala ho P-mofuta oa rona oa SiC Substrate Wafer. Ka ho kenyelletsa li-wafers tsena ts'ebetsong ea hau ea tlhahiso, u etsa bonnete ba hore lisebelisoa tsa hau li rua molemo ho tsoa mefuteng e ikhethang ea mocheso le ea motlakase ea SiC, e li nolofalletsang ho sebetsa ka katleho tlas'a maemo a thata.

Ho tsetela ho Semicera's P-type SiC Substrate Wafer ho bolela ho khetha sehlahisoa se kopanyang mahlale a mahlale a morao-rao le boenjiniere bo hlokolosi. Semicera e ikemiselitse ho ts'ehetsa moloko o latelang oa theknoloji ea elektroniki le ea optoelectronic, e fana ka likarolo tsa bohlokoa tse hlokahalang bakeng sa katleho ea hau indastering ea semiconductor.

Lintho	Tlhahiso	Patlisiso	Dummy
Crystal Parameters
Polytype	4H
Phoso ea ho shebana le bokaholimo	<11-20>4±0.15°
Litekanyetso tsa Motlakase
Dopant	n-mofuta oa Nitrojene
Ho hanyetsa	0.015-0.025ohm · cm
Mechanical Parameters
Diameter	150.0±0.2mm
Botenya	350±25 μm
Boemo ba mantlha bo bataletseng	[1-100]±5°
Bolelele ba pele bo bataletseng	47.5±1.5mm
Folete ea bobeli	Ha ho letho
TTV	≤5 μm	≤10 μm	≤15 μm
LTV	≤3 μm(5mm*5mm)	≤5 μm(5mm*5mm)	≤10 μm(5mm*5mm)
Inamela	-15μm ~ 15μm	-35μm ~ 35μm	-45μm ~ 45μm
Warp	≤35 μm	≤45 μm	≤55 μm
Front(Si-face) roughness(AFM)	Ra≤0.2nm (5μm*5μm)
Sebopeho
Boima ba micropipe	<1 e/cm2	<10 e/cm2	<15 e/cm2
Litšila tsa tšepe	≤5E10atoms/cm2		NA
BPD	≤1500 ea/cm2	≤3000 ea/cm2	NA
TSD	≤500 ea/cm2	≤1000 ea/cm2	NA
Boleng ba Pele
Pele	Si
Qetello ea bokaholimo	Si-face CMP
Likaroloana	≤60ea/wafer (boholo ≥0.3μm)	NA
Mengwapo	≤5ea/mm. Bolelele ba kakaretso ≤Diameter	Bolelele bo akaretsang≤2*Diameter	NA
Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso	Ha ho letho		NA
Li-edge chips/indents/fracture/hex plates	Ha ho letho
Libaka tsa polytype	Ha ho letho	Kakaretso≤20%	Kakaretso≤30%
Ho tšoaea ka laser ka pele	Ha ho letho
Boleng ba Morao
Qetello ea morao	C-sefahleho sa CMP
Mengwapo	≤5ea/mm, bolelele bo akaretsang≤2* bophara	NA
Litšitiso tse ka morao (li-chips / indents)	Ha ho letho
Bokhopo ba mokokotlo	Ra≤0.2nm (5μm*5μm)
Ho tšoaea ka morao laser	1 mm (ho tloha pheletsong e ka holimo)
Qetello
Qetello	Chamfer
Sephutheloana
Sephutheloana	Epi-reading ka sephutheloana sa vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata
*Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD.