Semicerae thabela ho fana kaPFA Cassette, khetho ea pele bakeng sa ho sebetsana le li-wafer libakeng tseo ho tsona ho hanyetsanang le lik'hemik'hale le ho tšoarella ho leng bohlokoa. E entsoe ka thepa ea Perfluoroalkoxy (PFA) ea boleng bo phahameng, k'hasete ena e etselitsoe ho mamella maemo a boima ka ho fetesisa a entsoeng ka semiconductor, ho netefatsa polokeho le bots'epehi ba liphaephe tsa hau.
Khanyetso ea lik'hemik'hale e ke keng ea lekanngoaThePFA Cassettee etselitsoe ho fana ka khanyetso e phahameng ho mefuta e mengata ea lik'hemik'hale, e etsa hore e be khetho e phethahetseng bakeng sa lits'ebetso tse kenyelletsang li-acid tse mabifi, li-solvents le lik'hemik'hale tse ling tse thata. Khanyetso ena e matla ea lik'hemik'hale e tiisa hore k'hasete e lula e tiile 'me e sebetsa esita le libakeng tse senyang ka ho fetisisa, kahoo e lelefatsa bophelo ba eona le ho fokotsa tlhokahalo ea ho nkeloa sebaka khafetsa.
Kaho ea Bohloeki bo PhahamengLisosa tsa SemiceraPFA Cassettee entsoe ka thepa ea PFA e hloekileng haholo, e bohlokoa ho thibela tšilafalo nakong ea ts'ebetso ea wafer. Kaho ena e hloekileng haholo e fokotsa kotsi ea ho hlahisa likaroloana le ho tsoa ka lik'hemik'hale, ho netefatsa hore liphaphatha tsa hau li sirelelitsoe litšila tse ka senyang boleng ba tsona.
Ntlafatso ea ho tšoarella le ts'ebetso e ntlafetsengE etselitsoe ho tšoarella, thePFA Cassettee boloka botšepehi ba eona ba sebopeho tlas'a mocheso o feteletseng le maemo a thata a ho sebetsa. Ebang e le tlas'a mocheso o phahameng kapa e tšoaroa khafetsa, k'hasete ena e boloka sebopeho le ts'ebetso ea eona, e fana ka ts'epo ea nako e telele maemong a boima a tlhahiso.
Precision Engineering bakeng sa Tšoaro e SireletsehilengTheSemicera PFA Cassettee na le boenjineri bo nepahetseng bo netefatsang ts'ebetso e sireletsehileng le e tsitsitseng ea wafer. Sekotjana se seng le se seng se entsoe ka hloko ho tšoara liphaphatha ka mokhoa o sireletsehileng, ho thibela motsamao ofe kapa ofe kapa ho sisinyeha ho ka bakang tšenyo. Boenjineri bona bo nepahetseng bo ts'ehetsa ho beoa ka mokhoa o ts'oanang le o nepahetseng oa li-wafer, tse tlatsetsang katlehong ea ts'ebetso ka kakaretso.
Tšebeliso e fapaneng ho pholletsa le MekhoaKa lebaka la thepa ea eona e phahameng ea thepa, thePFA Cassettee sebetsa ka mefuta-futa e lekaneng hore e ka sebelisoa ho pholletsa le mekhahlelo e fapaneng ea tlhahiso ea semiconductor. E loketse ka ho khetheha bakeng sa etching e metsi, k'hemik'hale ea mouoane oa lik'hemik'hale (CVD), le mekhoa e meng e kenyelletsang tikoloho e thata ea lik'hemik'hale. Ho ikamahanya le maemo ho etsa hore e be sesebelisoa sa bohlokoa ho boloka botšepehi ba ts'ebetso le boleng ba li-wafer.
Boitlamo ho Boleng le BoqapiHo Semicera, re ikemiselitse ho fana ka lihlahisoa tse finyellang litekanyetso tse phahameng ka ho fetisisa tsa indasteri. ThePFA Cassettee fana ka mohlala oa boitlamo bona, e fana ka tharollo e tšepahalang e kopanyang ka mokhoa o hlakileng lits'ebetsong tsa hau tsa tlhahiso. K'hasete e 'ngoe le e 'ngoe e tlas'a taolo e tiileng ea boleng ho netefatsa hore e finyella litekanyetso tsa rona tse tiileng tsa ts'ebetso, e fana ka bokhabane boo u bo lebeletseng ho Semicera.
Lintho | Tlhahiso | Patlisiso | Dummy |
Crystal Parameters | |||
Polytype | 4H | ||
Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
Litekanyetso tsa Motlakase | |||
Dopant | n-mofuta oa Nitrojene | ||
Ho hanyetsa | 0.015-0.025ohm · cm | ||
Mechanical Parameters | |||
Diameter | 150.0±0.2mm | ||
Botenya | 350±25 μm | ||
Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
Folete ea bobeli | Ha ho letho | ||
TTV | ≤5 μm | ≤10 μm | ≤15 μm |
LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
Warp | ≤35 μm | ≤45 μm | ≤55 μm |
Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
Sebopeho | |||
Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
Boleng ba Pele | |||
Pele | Si | ||
Qetello ea bokaholimo | Si-face CMP | ||
Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
Ho tšoaea ka laser ka pele | Ha ho letho | ||
Boleng ba Morao | |||
Qetello ea morao | C-sefahleho sa CMP | ||
Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
Qetello | |||
Qetello | Chamfer | ||
Sephutheloana | |||
Sephutheloana | Epi-reading ka sephutheloana sa vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
*Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. |