Theko e qotsitsoeng ea High Precision Fully Automatic Wafer Thinning Ho sila Mochini oa ho Pholisa le oa Chamfering

Re lumela hore tšebelisano-'moho ea nako e telele e bakiloe ke boleng ba boleng bo holimo, ts'ebeletso e kenyellelitsoeng boleng, boiphihlelo bo ruileng le ho ikopanya le motho ka mong bakeng sa theko e qotsitsoeng bakeng sa High Precision Fully Automatic Wafer Thinning Grinding Polishing and Chamfering Machine, Re atisa ho tsoela pele ka molao-motheo oa "Botšepehi, Bokhoni ba ho sebetsa hantle. , Khoebo ea Boqapi le Ho Hlōla”. Rea u amohela ho ea webosaeteng ea rona 'me le ka mohla u se ke oa tsilatsila ho buisana le rona. Na le se le lokile? ? ? A re tsamayeng!!!
Re lumela hore tšebelisano-'moho ea nako e telele e bakiloe ke boleng ba boleng bo holimo, litšebeletso tsa boleng bo holimo, boiphihlelo bo monate le ho ikopanya le motho ka mong bakeng saChina Wafer Chamfering Machine le Wafer, Re 'nile ra sebetsa ka lilemo tse fetang 10. Re inehetse ho lihlahisoa tsa boleng le tharollo le tšehetso ea bareki. Hajoale re na le lisebelisoa tse 27 tsa lisebelisoa le litokelo tsa moralo. Re u mema hore u etele k'hamphani ea rona bakeng sa bohahlauli ba hau le tataiso e tsoetseng pele ea khoebo.

Zirconia ke thepa e nang le matla a phahameng a mochine le ho robeha ho thata ka mocheso oa kamore. Zirconia ea rona (ZrO2) e kenyelelitsoe ka 3mol% Y2O3 zirconia e tsitsitseng e tsitsitseng (PSZ). Hobane bophara ba karoloana ea thepa ea PSZ e nyane, e ka sebetsoa ka nepo e phahameng, mme ts'ebeliso ea eona likarolong tse nepahetseng tsa machining joalo ka hlobo e ntse e hola. Ntle le moo, e ka sebelisoa bakeng sa lisebelisoa tsa indasteri, likarolo tsa sehokelo sa optical le lisebelisoa tse silakanyang. The high fracture toughness of PSZ e ka sebelisoa ho etsa liliba tse khethehileng, hape e sebelisoa haholo ka lithipa tsa ceramic tsa malapeng, slicer le likarolo tse ling.

Zirconia (ZrO2) Ke sebelisa haholo

Lisebelisoa tsa hlobo le hlobo (liforomo tse fapa-fapaneng, mokhoa o nepahetseng oa ho beha maemo, ho kenya letsoho); Likarolo tsa Mill (classifier, leloala la phallo ea moea, leloala la lifaha); Sesebelisoa sa indasteri (seha sa indasteri, mochini oa slitter, moqolo oa khatiso o bataletseng); Likarolo tsa sehokelo sa Optical (ring ea ho tiisa, sleeve, sebopeho sa V-groove); Selemo se khethehileng (coil spring, plate spring); Lihlahisoa tsa bareki (screwdriver tse nyane tse insulated, thipa ea ceramic, slicer).

Re lumela hore tšebelisano-'moho ea nako e telele e bakiloe ke boleng ba boleng bo holimo, ts'ebeletso e kenyellelitsoeng boleng, boiphihlelo bo ruileng le ho ikopanya le motho ka mong bakeng sa theko e qotsitsoeng bakeng sa High Precision Fully Automatic Wafer Thinning Grinding Polishing and Chamfering Machine, Re atisa ho tsoela pele ka molao-motheo oa "Botšepehi, Bokhoni ba ho sebetsa hantle. , Khoebo ea Boqapi le Ho Hlōla”. Rea u amohela ho ea webosaeteng ea rona 'me le ka mohla u se ke oa tsilatsila ho buisana le rona. Na le se le lokile? ? ? A re tsamayeng!!!
Theko e qotsitsoeng bakeng saChina Wafer Chamfering Machine le Wafer, Re 'nile ra sebetsa ka lilemo tse fetang 10. Re inehetse ho lihlahisoa tsa boleng le tharollo le tšehetso ea bareki. Hajoale re na le lisebelisoa tse 27 tsa lisebelisoa le litokelo tsa moralo. Re u mema hore u etele k'hamphani ea rona bakeng sa bohahlauli ba hau le tataiso e tsoetseng pele ea khoebo.