Semicerae hlahisaSemiconductor Cassette, sesebelisoa sa bohlokoa bakeng sa ts'ebetso e sireletsehileng le e sebetsang ea li-wafers nakong eohle ea tlhahiso ea semiconductor. Kaha e entsoe ka mokhoa o nepahetseng haholo, k'hasete ena e netefatsa hore liphaephe tsa hau li bolokiloe ka mokhoa o sireletsehileng 'me li tsamaisoa ka mokhoa o sireletsehileng, li boloka botšepehi ba tsona boemong bo bong le bo bong.
Tšireletso e Phahameng le ho tšoarellaTheSemiconductor Cassetteho tloha Semicera e hahiloe ho fana ka tšireletso e phahameng ho li-wafers tsa hau. E hahiloe ka thepa e matla, e hananang le tšilafalo, e sireletsa liphaphatha tsa hau tšenyong e ka bang teng le tšilafalong, e leng se etsang hore e be khetho e nepahetseng bakeng sa tikoloho ea likamore tse hloekileng. Moralo oa k'hasete o fokotsa tlhahiso ea likaroloana 'me o etsa bonnete ba hore li-wafers li lula li sa ameha ebile li sireletsehile nakong ea ho li tšoara le ho li tsamaisa.
Moralo o Matlafalitsoeng oa Ts'ebetso e NtleLisosa tsa SemiceraSemiconductor Cassettee na le moetso o entsoeng ka bokhabane o fanang ka tatellano e nepahetseng ea wafer, e fokotsang kotsi ea ho se tsamaisane hantle le tšenyo ea mochini. Likhasete tsa khasete li arohane hantle ho tšoara sephaphatha ka seng ka mokhoa o sireletsehileng, ho thibela motsamao ofe kapa ofe o ka bakang mengoapo kapa mefokolo e meng.
Ho feto-fetoha ha maemo le ho lumellanaTheSemiconductor Cassettee sebetsa ka mefuta-futa ebile e lumellana le boholo bo fapaneng ba liphaephe, e etsa hore e tšoanele mekhahlelo e fapaneng ea masela a semiconductor. Hore na o sebetsa ka litekanyo tse tloaelehileng kapa tse tloahelehileng, k'hasete ena e ikamahanya le litlhoko tsa hau, e fana ka monyetla oa ho fetoha le maemo lits'ebetsong tsa hau tsa tlhahiso.
Ts'ebetso e Nolofalitsoeng le BokhabaneE entsoe ho nahanoa ka mosebelisi, theKhasete ea Semiconductor ea Semicerae bobebe ebile e bonolo ho sebetsana le eona, e lumella ho kenya le ho laolla kapele le ka nepo. Moralo ona oa ergonomic ha o boloke nako feela empa o boetse o fokotsa kotsi ea phoso ea motho, o netefatsa ts'ebetso e boreleli kahare ho setsi sa hau.
Ho Kopana le Maemo a IndasteriSemicera e netefatsa horeSemiconductor Cassettee kopana le maemo a phahameng ka ho fetisisa a indasteri bakeng sa boleng le ho tšepahala. Khasete e 'ngoe le e 'ngoe e etsa liteko tse matla ho netefatsa hore e sebetsa ka mokhoa o tsitsitseng tlas'a maemo a boima a tlhahiso ea semiconductor. Boinehelo bona ba boleng bo tiisa hore li-wafers tsa hau li lula li sirelelitsoe, li boloka litekanyetso tse phahameng tse hlokahalang indastering.
| Lintho | Tlhahiso | Patlisiso | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
| Litekanyetso tsa Motlakase | |||
| Dopant | n-mofuta oa Nitrojene | ||
| Ho hanyetsa | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Botenya | 350±25 μm | ||
| Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
| Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
| Folete ea bobeli | Ha ho letho | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Sebopeho | |||
| Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
| Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Boleng ba Pele | |||
| Pele | Si | ||
| Qetello ea bokaholimo | Si-face CMP | ||
| Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
| Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
| Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
| Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
| Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
| Ho tšoaea ka laser ka pele | Ha ho letho | ||
| Boleng ba Morao | |||
| Qetello ea morao | C-sefahleho sa CMP | ||
| Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
| Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
| Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
| Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
| Qetello | |||
| Qetello | Chamfer | ||
| Sephutheloana | |||
| Sephutheloana | Epi e loketse ho paka ka vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
| *Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. | |||
