Semiconductor Cassette

Tlhaloso e Khutšoanyane:

Semiconductor Cassette- Sireletsa le ho tsamaisa liphaephe tsa hau ka nepo u sebelisa Cassette ea Semiconductor ea Semicera, e etselitsoeng ho netefatsa polokeho le ts'ebetso e nepahetseng tikolohong ea tlhahiso ea theknoloji e phahameng.


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Semicerae hlahisaSemiconductor Cassette, sesebelisoa sa bohlokoa bakeng sa ts'ebetso e sireletsehileng le e sebetsang ea li-wafers nakong eohle ea tlhahiso ea semiconductor. Kaha e entsoe ka mokhoa o nepahetseng haholo, k'hasete ena e netefatsa hore liphaephe tsa hau li bolokiloe ka mokhoa o sireletsehileng 'me li tsamaisoa ka mokhoa o sireletsehileng, li boloka botšepehi ba tsona boemong bo bong le bo bong.

Tšireletso e Phahameng le ho tšoarellaTheSemiconductor Cassetteho tloha Semicera e hahiloe ho fana ka tšireletso e phahameng ho li-wafers tsa hau. E hahiloe ka thepa e matla, e hananang le tšilafalo, e sireletsa liphaphatha tsa hau tšenyong e ka bang teng le tšilafalong, e leng se etsang hore e be khetho e nepahetseng bakeng sa tikoloho ea likamore tse hloekileng. Moralo oa k'hasete o fokotsa tlhahiso ea likaroloana 'me o etsa bonnete ba hore li-wafers li lula li sa ameha ebile li sireletsehile nakong ea ho li tšoara le ho li tsamaisa.

Moralo o Matlafalitsoeng oa Ts'ebetso e NtleLisosa tsa SemiceraSemiconductor Cassettee na le moetso o entsoeng ka bokhabane o fanang ka tatellano e nepahetseng ea wafer, e fokotsang kotsi ea ho se tsamaisane hantle le tšenyo ea mochini. Likhasete tsa khasete li arohane hantle ho tšoara sephaphatha ka seng ka mokhoa o sireletsehileng, ho thibela motsamao ofe kapa ofe o ka bakang mengoapo kapa mefokolo e meng.

Ho feto-fetoha ha maemo le ho lumellanaTheSemiconductor Cassettee sebetsa ka mefuta-futa ebile e lumellana le boholo bo fapaneng ba liphaephe, e etsa hore e tšoanele mekhahlelo e fapaneng ea masela a semiconductor. Hore na o sebetsa ka litekanyo tse tloaelehileng kapa tse tloahelehileng, k'hasete ena e ikamahanya le litlhoko tsa hau, e fana ka monyetla oa ho fetoha le maemo lits'ebetsong tsa hau tsa tlhahiso.

Tšebeliso e Nolofalitsoeng le BokhabaneE entsoe ho nahanoa ka mosebelisi, theKhasete ea Semiconductor ea Semicerae bobebe ebile e bonolo ho sebetsana le eona, e lumella ho kenya le ho laolla kapele le ka nepo. Moralo ona oa ergonomic ha o boloke nako feela empa o boetse o fokotsa kotsi ea phoso ea motho, o netefatsa ts'ebetso e boreleli kahare ho setsi sa hau.

Ho Kopana le Maemo a IndasteriSemicera e netefatsa horeSemiconductor Cassettee kopana le maemo a phahameng ka ho fetisisa a indasteri bakeng sa boleng le ho tšepahala. Khasete e 'ngoe le e 'ngoe e etsa liteko tse matla ho netefatsa hore e sebetsa ka mokhoa o tsitsitseng tlas'a maemo a boima a tlhahiso ea semiconductor. Boinehelo bona ba boleng bo tiisa hore li-wafers tsa hau li lula li sirelelitsoe, li boloka litekanyetso tse phahameng tse hlokahalang indastering.

Lintho

Tlhahiso

Patlisiso

Dummy

Crystal Parameters

Polytype

4H

Phoso ea ho shebana le bokaholimo

<11-20>4±0.15°

Litekanyetso tsa Motlakase

Dopant

n-mofuta oa Nitrojene

Ho hanyetsa

0.015-0.025ohm · cm

Mechanical Parameters

Diameter

150.0±0.2mm

Botenya

350±25 μm

Boemo ba mantlha bo bataletseng

[1-100]±5°

Bolelele ba pele bo bataletseng

47.5±1.5mm

Folete ea bobeli

Ha ho letho

TTV

≤5 μm

≤10 μm

≤15 μm

LTV

≤3 μm(5mm*5mm)

≤5 μm(5mm*5mm)

≤10 μm(5mm*5mm)

Inamela

-15μm ~ 15μm

-35μm ~ 35μm

-45μm ~ 45μm

Warp

≤35 μm

≤45 μm

≤55 μm

Front(Si-face) roughness(AFM)

Ra≤0.2nm (5μm*5μm)

Sebopeho

Boima ba micropipe

<1 e/cm2

<10 e/cm2

<15 e/cm2

Litšila tsa tšepe

≤5E10atoms/cm2

NA

BPD

≤1500 ea/cm2

≤3000 ea/cm2

NA

TSD

≤500 ea/cm2

≤1000 ea/cm2

NA

Boleng ba Pele

Pele

Si

Qetello ea bokaholimo

Si-face CMP

Likaroloana

≤60ea/wafer (boholo ≥0.3μm)

NA

Mengwapo

≤5ea/mm. Bolelele ba kakaretso ≤Diameter

Bolelele bo akaretsang≤2*Diameter

NA

Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso

Ha ho letho

NA

Li-edge chips/indents/fracture/hex plates

Ha ho letho

Libaka tsa polytype

Ha ho letho

Kakaretso≤20%

Kakaretso≤30%

Ho tšoaea ka laser ka pele

Ha ho letho

Boleng ba Morao

Qetello ea morao

C-sefahleho sa CMP

Mengwapo

≤5ea/mm, bolelele bo akaretsang≤2* bophara

NA

Litšitiso tse ka morao (li-chips / indents)

Ha ho letho

Bokhopo ba mokokotlo

Ra≤0.2nm (5μm*5μm)

Ho tšoaea ka morao laser

1 mm (ho tloha pheletsong e ka holimo)

Qetello

Qetello

Chamfer

Sephutheloana

Sephutheloana

Epi-reading ka sephutheloana sa vacuum

Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata

*Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD.

tech_1_2_size
Li-wafers tsa SiC

  • E fetileng:
  • E 'ngoe: