Ke Substrate

Tlhaloso e Khutšoanyane:

Ka bohloeki ba eona bo holimo le bohloeki bo phahameng, Semicera's Si Substrate e netefatsa ts'ebetso e ts'epahalang le e tsitsitseng lits'ebetsong tsa bohlokoa, ho kenyeletsoa tlhahiso ea Epi-Wafer le Gallium Oxide (Ga2O3). E etselitsoe ho ts'ehetsa tlhahiso ea li-microelectronics tse tsoetseng pele, substrate ena e fana ka tšebelisano e ikhethang le botsitso, e e etsa sesebelisoa sa bohlokoa bakeng sa mahlale a morao-rao makaleng a likhokahano, likoloi le indasteri.


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Si Substrate ka Semicera ke karolo ea bohlokoa tlhahisong ea lisebelisoa tsa semiconductor tse sebetsang hantle haholo. E entsoe ho tsoa ho Silicon ea boleng bo holimo (Si), substrate ena e fana ka ho tšoana ho ikhethang, botsitso le ts'ebetso e ntle haholo, e etsa hore e be e loketseng mefuta e mengata ea lits'ebetso tse tsoetseng pele indastering ea semiconductor. Ebang e sebelisoa ho Si Wafer, SiC Substrate, SOI Wafer, kapa SiN Substrate tlhahiso, Semicera Si Substrate e fana ka boleng bo tsitsitseng le ts'ebetso e phahameng ho fihlela litlhoko tse ntseng li hola tsa mahlale a sejoale-joale a elektroniki le thepa.

Ts'ebetso e sa Bapisitsoeng ka Bohloeki bo Phahameng le Bonepa

Semicera's Si Substrate e etsoa ka mekhoa e tsoetseng pele e netefatsang bohloeki bo phahameng le taolo e tiileng ea likarolo. Substrate e sebetsa e le motheo oa tlhahiso ea lisebelisoa tse fapaneng tse sebetsang hantle, ho kenyeletsoa Epi-Wafers le AlN Wafers. Ho nepahala le ho ts'oana ha Si Substrate ho etsa hore e be khetho e ntle haholo bakeng sa ho theha likarolo tse tšesaane tsa epitaxial le likarolo tse ling tsa bohlokoa tse sebelisoang tlhahisong ea li-semiconductors tsa moloko o latelang. Hore na o sebetsa le Gallium Oxide (Ga2O3) kapa lisebelisoa tse ling tse tsoetseng pele, Semicera's Si Substrate e netefatsa maemo a holimo a ts'epahalo le ts'ebetso.

Likopo ho Semiconductor Manufacturing

Indastering ea semiconductor, Si Substrate e tsoang Semicera e sebelisoa ka mefuta e mengata ea likopo, ho kenyeletsoa tlhahiso ea Si Wafer le SiC Substrate, moo e fanang ka motheo o tsitsitseng, o ka tšeptjoang bakeng sa ho beha likarolo tse sebetsang. Substrate e bapala karolo ea bohlokoa ho theheng SOI Wafers (Silicon On Insulator), e bohlokoa bakeng sa li-microelectronics tse tsoetseng pele le li-circuits tse kopantsoeng. Ho feta moo, li-Epi-Wafers (epitaxial wafers) tse hahiloeng holim'a Si Substrates li bohlokoa ho hlahiseng lisebelisoa tsa semiconductor tse sebetsang hantle joalo ka li-transistors tsa motlakase, diode le li-circuits tse kopaneng.

Si Substrate e boetse e ts'ehetsa tlhahiso ea lisebelisoa tse sebelisang Gallium Oxide (Ga2O3), e leng thepa e tšepisang e nang le li-bandgap tse kholo tse sebelisoang bakeng sa ts'ebeliso ea matla a phahameng ho lisebelisoa tsa motlakase tsa motlakase. Ntle le moo, ho tsamaellana ha Semicera's Si Substrate le AlN Wafers le li-substrates tse ling tse tsoetseng pele ho netefatsa hore e ka fihlela litlhoko tse fapaneng tsa indasteri ea theknoloji e phahameng, e etsa hore e be tharollo e nepahetseng bakeng sa tlhahiso ea lisebelisoa tsa morao-rao litabeng tsa mehala, likoloi le indasteri. .

Boleng bo ka tšeptjoang le bo tsitsitseng bakeng sa Likopo tsa High-Tech

Si Substrate e entsoeng ke Semicera e entsoe ka hloko ho fihlela litlhoko tse matla tsa masela a semiconductor. Botšepehi ba eona bo ikhethang ba sebopeho le boleng ba boleng bo holimo bo etsa hore e be thepa e loketseng ho sebelisoa lits'ebetsong tsa lik'hasete bakeng sa lipalangoang tsa li-wafer, hammoho le ho theha likarolo tse nepahetseng haholo lisebelisoa tsa semiconductor. Bokhoni ba substrate ba ho boloka boleng bo tsitsitseng tlas'a maemo a fapaneng a ts'ebetso bo tiisa bofokoli bo fokolang, ho ntlafatsa chai le ts'ebetso ea sehlahisoa sa ho qetela.

Ka conductivity ea eona e phahameng ea mocheso, matla a mochini, le bohloeki bo phahameng, Semicera's Si Substrate ke thepa ea khetho bakeng sa bahlahisi ba batlang ho finyella litekanyetso tse phahameng ka ho fetisisa tsa ho nepahala, ho tšepahala le ts'ebetso tlhahisong ea semiconductor.

Khetha Semicera's Si Substrate bakeng sa Litharollo tse Phahameng ka ho Fetisisa, tse sebetsang hantle

Bakeng sa baetsi ba indasteri ea semiconductor, Si Substrate e tsoang Semicera e fana ka tharollo e matla, ea boleng bo holimo bakeng sa mefuta e mengata ea likopo, ho tloha tlhahiso ea Si Wafer ho isa ho thehoeng ha Epi-Wafers le SOI Wafers. Ka bohloeki bo ke keng ba lekanngoa, ho nepahala le ho tšepahala, substrate ena e nolofalletsa tlhahiso ea lisebelisoa tsa semiconductor tse se nang moeli, ho netefatsa ts'ebetso ea nako e telele le ts'ebetso e nepahetseng. Khetha Semicera bakeng sa litlhoko tsa hau tsa Si, 'me u tšepe sehlahisoa se etselitsoeng ho fihlela litlhoko tsa mahlale a hosane.

Lintho

Tlhahiso

Patlisiso

Dummy

Crystal Parameters

Polytype

4H

Phoso ea ho shebana le bokaholimo

<11-20>4±0.15°

Litekanyetso tsa Motlakase

Dopant

n-mofuta oa Nitrojene

Ho hanyetsa

0.015-0.025ohm · cm

Mechanical Parameters

Diameter

150.0±0.2mm

Botenya

350±25 μm

Boemo ba mantlha bo bataletseng

[1-100]±5°

Bolelele ba pele bo bataletseng

47.5±1.5mm

Folete ea bobeli

Ha ho letho

TTV

≤5 μm

≤10 μm

≤15 μm

LTV

≤3 μm(5mm*5mm)

≤5 μm(5mm*5mm)

≤10 μm(5mm*5mm)

Inamela

-15μm ~ 15μm

-35μm ~ 35μm

-45μm ~ 45μm

Warp

≤35 μm

≤45 μm

≤55 μm

Front(Si-face) roughness(AFM)

Ra≤0.2nm (5μm*5μm)

Sebopeho

Boima ba micropipe

<1 e/cm2

<10 e/cm2

<15 e/cm2

Litšila tsa tšepe

≤5E10atoms/cm2

NA

BPD

≤1500 ea/cm2

≤3000 ea/cm2

NA

TSD

≤500 ea/cm2

≤1000 ea/cm2

NA

Boleng ba Pele

Pele

Si

Qetello ea bokaholimo

Si-face CMP

Likaroloana

≤60ea/wafer (boholo ≥0.3μm)

NA

Mengwapo

≤5ea/mm. Bolelele ba kakaretso ≤Diameter

Bolelele bo akaretsang≤2*Diameter

NA

Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso

Ha ho letho

NA

Li-edge chips/indents/fracture/hex plates

Ha ho letho

Libaka tsa polytype

Ha ho letho

Kakaretso≤20%

Kakaretso≤30%

Ho tšoaea ka laser ka pele

Ha ho letho

Boleng ba Morao

Qetello ea morao

C-sefahleho sa CMP

Mengwapo

≤5ea/mm, bolelele bo akaretsang≤2* bophara

NA

Litšitiso tse ka morao (li-chips / indents)

Ha ho letho

Bokhopo ba mokokotlo

Ra≤0.2nm (5μm*5μm)

Ho tšoaea ka morao laser

1 mm (ho tloha pheletsong e ka holimo)

Qetello

Qetello

Chamfer

Sephutheloana

Sephutheloana

Epi e loketse ho paka ka vacuum

Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata

*Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD.

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Li-wafers tsa SiC

  • E fetileng:
  • E 'ngoe: