Filimi ea Silicon e entsoeng ke Semicera ke thepa ea boleng bo holimo, e nepahetseng e entsoeng ho finyella litlhoko tse thata tsa indasteri ea semiconductor. E entsoe ka silicon e hloekileng, tharollo ena ea filimi e tšesaane e fana ka ho tšoana ho hoholo, bohloeki bo phahameng, le thepa e ikhethang ea motlakase le ea mocheso. E loketse ho sebelisoa lits'ebetsong tse fapaneng tsa semiconductor, ho kenyelletsa tlhahiso ea Si Wafer, SiC Substrate, SOI Wafer, SiN Substrate, le Epi-Wafer. Filimi ea Silicon ea Semicera e netefatsa ts'ebetso e ts'epahalang le e tsitsitseng, e e etsa thepa ea bohlokoa bakeng sa li-microelectronics tse tsoetseng pele.
Boleng bo Phahameng le Ts'ebetso ea Tlhahiso ea Semiconductor
Filimi ea Silicon ea Semicera e tsebahala ka matla a eona a matla a mochini, botsitso bo phahameng ba mocheso, le litekanyetso tse tlase tsa sekoli, tseo kaofela li leng bohlokoa ho thehoeng ha li-semiconductors tse sebetsang hantle haholo. Ho sa tsotellehe hore na e sebelisoa ho hlahisa lisebelisoa tsa Gallium Oxide (Ga2O3), AlN Wafer, kapa Epi-Wafers, filimi e fana ka motheo o tiileng oa ho beha filimi e tšesaane le ho hōla ha epitaxial. Ho tsamaellana ha eona le likaroloana tse ling tsa semiconductor joalo ka SiC Substrate le SOI Wafers li netefatsa kopanyo e se nang moeli lits'ebetsong tse teng tsa tlhahiso, ho thusa ho boloka chai e ngata le boleng bo tsitsitseng ba sehlahisoa.
Likopo ho Indasteri ea Semiconductor
Indastering ea semiconductor, Semicera's Silicon Film e sebelisoa lits'ebetsong tse fapaneng, ho tloha tlhahisong ea Si Wafer le SOI Wafer ho isa lits'ebetsong tse ikhethileng joalo ka SiN Substrate le popo ea Epi-Wafer. Bohloeki bo phahameng le ho nepahala ha filimi ena ho etsa hore e be ea bohlokoa tlhahisong ea likarolo tse tsoetseng pele tse sebelisoang nthong e 'ngoe le e' ngoe ho tloha ho li-microprocessors le li-circuits tse kopantsoeng ho lisebelisoa tsa optoelectronic.
Filimi ea Silicon e bapala karolo ea bohlokoa lits'ebetsong tsa semiconductor joalo ka kholo ea epitaxial, wafer bonding, le deposition ea filimi e tšesaane. Thepa ea eona e tšepahalang e bohlokoa haholo indastering e hlokang tikoloho e laoloang haholo, joalo ka likamore tse hloekileng tsa masela a semiconductor. Ntle le moo, Filimi ea Silicon e ka kopanngoa le lits'ebetso tsa lik'hasete bakeng sa ho ts'oaroa ka mokhoa o nepahetseng oa liphaephe le lipalangoang nakong ea tlhahiso.
Botšepehi ba Nako e telele le ho tsitsisa
E 'ngoe ea melemo ea bohlokoa ea ho sebelisa Semicera's Silicon Film ke ho tšepahala ha eona nako e telele. Ka ho tšoarella ha eona ho babatsehang le boleng bo tsitsitseng, filimi ena e fana ka tharollo e ka tšeptjoang bakeng sa maemo a phahameng a tlhahiso ea lihlahisoa. Ho sa tsotellehe hore na e sebelisoa ka lisebelisoa tse phahameng tsa semiconductor kapa lisebelisoa tse tsoetseng pele tsa elektronike, Semicera's Silicon Film e tiisa hore bahlahisi ba ka finyella ts'ebetso e phahameng le ho tšepahala ho lihlahisoa tse ngata.
Hobaneng o Khetha Filimi ea Silicon ea Semicera?
Filimi ea Silicon e tsoang ho Semicera ke sesebelisoa sa bohlokoa bakeng sa lits'ebetso tse tsoetseng pele indastering ea semiconductor. Thepa ea eona ea ts'ebetso e phahameng, e kenyelletsang botsitso bo botle ba mocheso, bohloeki bo phahameng, le matla a mochini, e etsa khetho e nepahetseng bakeng sa bahlahisi ba batlang ho fihlela litekanyetso tse phahameng ka ho fetisisa tlhahisong ea semiconductor. Ho tloha ho Si Wafer le SiC Substrate ho isa tlhahiso ea lisebelisoa tsa Gallium Oxide Ga2O3, filimi ena e fana ka boleng bo ke keng ba lekanngoa le ts'ebetso.
Ka Filimi ea Silicon ea Semicera, o ka tšepa sehlahisoa se fihlelang litlhoko tsa tlhahiso ea semiconductor ea sejoale-joale, se fanang ka motheo o tšepahalang bakeng sa moloko o latelang oa lisebelisoa tsa elektroniki.
| Lintho | Tlhahiso | Patlisiso | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
| Litekanyetso tsa Motlakase | |||
| Dopant | n-mofuta oa Nitrojene | ||
| Ho hanyetsa | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Botenya | 350±25 μm | ||
| Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
| Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
| Folete ea bobeli | Ha ho letho | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Sebopeho | |||
| Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
| Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Boleng ba Pele | |||
| Pele | Si | ||
| Qetello ea bokaholimo | Si-face CMP | ||
| Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
| Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
| Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
| Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
| Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
| Ho tšoaea ka laser ka pele | Ha ho letho | ||
| Boleng ba Morao | |||
| Qetello ea morao | C-sefahleho sa CMP | ||
| Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
| Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
| Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
| Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
| Qetello | |||
| Qetello | Chamfer | ||
| Sephutheloana | |||
| Sephutheloana | Epi e loketse ho paka ka vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
| *Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. | |||
