Semicera's Silicon Nitride Ceramic Substrate e emela sehlohlolong sa theknoloji ea thepa e tsoetseng pele, e fanang ka ts'ebetso e ikhethang ea mocheso le thepa e matla ea mochini. E entsoe bakeng sa lits'ebetso tse sebetsang hantle, substrate ena e sebetsa hantle haholo libakeng tse hlokang taolo e tšepahalang ea mocheso le sebopeho sa sebopeho.
Likarolo tsa rona tsa Silicon Nitride Ceramic Substrates li etselitsoe ho mamella mocheso o feteletseng le maemo a thata, a li etsa tse loketseng lisebelisoa tsa elektroniki tse matla a holimo le a maqhubu a phahameng. Ts'ebetso ea bona e phahameng ea mocheso e etsa bonnete ba ho senya mocheso o sebetsang hantle, e leng oa bohlokoa bakeng sa ho boloka ts'ebetso le nako e telele ea likarolo tsa elektronike.
Boitlamo ba Semicera ho boleng bo bonahala ho Silicon Nitride Ceramic Substrate e 'ngoe le e' ngoe eo re e hlahisang. Substrate e 'ngoe le e' ngoe e etsoa ho sebelisoa mekhoa ea morao-rao ho netefatsa ts'ebetso e tsitsitseng le mefokolo e fokolang. Boemo bona bo phahameng ba ho nepahala bo tšehetsa litlhoko tse matla tsa liindasteri tse kang tsa makoloi, sefofane le likhokahano tsa mehala.
Ntle le melemo ea bona ea mocheso le mochini, li-substrates tsa rona li fana ka thepa e ntle haholo ea ho kenya motlakase, e kenyang letsoho ho ts'epahalleng ha lisebelisoa tsa hau tsa elektroniki. Ka ho fokotsa tšitiso ea motlakase le ho matlafatsa botsitso ba likaroloana, Semicera's Silicon Nitride Ceramic Substrates e bapala karolo ea bohlokoa ho ntlafatseng ts'ebetso ea sesebelisoa.
Ho khetha Semicera's Silicon Nitride Ceramic Substrate ho bolela ho tsetela ho sehlahisoa se fanang ka ts'ebetso e phahameng le ho tšoarella nako e telele. Li-substrates tsa rona li etselitsoe ho fihlela litlhoko tsa lits'ebetso tsa elektroniki tse tsoetseng pele, ho netefatsa hore lisebelisoa tsa hau li rua molemo ho theknoloji ea morao-rao le ho ts'epahala ho ikhethang.
| Lintho | Tlhahiso | Patlisiso | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
| Litekanyetso tsa Motlakase | |||
| Dopant | n-mofuta oa Nitrojene | ||
| Ho hanyetsa | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Botenya | 350±25 μm | ||
| Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
| Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
| Folete ea bobeli | Ha ho letho | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Sebopeho | |||
| Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
| Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Boleng ba Pele | |||
| Pele | Si | ||
| Qetello ea bokaholimo | Si-face CMP | ||
| Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
| Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
| Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
| Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
| Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
| Ho tšoaea ka laser ka pele | Ha ho letho | ||
| Boleng ba Morao | |||
| Qetello ea morao | C-sefahleho sa CMP | ||
| Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
| Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
| Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
| Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
| Qetello | |||
| Qetello | Chamfer | ||
| Sephutheloana | |||
| Sephutheloana | Epi-reading ka sephutheloana sa vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
| *Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. | |||
