Semicera's Silicon On Insulator (SOI) Wafer e ka pele ho boqapi ba semiconductor, e fanang ka karohano e ntlafalitsoeng ea motlakase le ts'ebetso e phahameng ea mocheso. Sebopeho sa SOI, se nang le lera le lesesaane la silicon holim'a substrate e sireletsang, e fana ka melemo ea bohlokoa bakeng sa lisebelisoa tsa elektronike tse sebetsang hantle.
Li-wafers tsa rona tsa SOI li etselitsoe ho fokotsa matla a likokoana-hloko le maqhubu a lutlang, a bohlokoa bakeng sa ho theha li-circuits tse kopantsoeng ka lebelo le phahameng le tse tlaase. Theknoloji ena e tsoetseng pele e netefatsa hore lisebelisoa li sebetsa hantle, ka lebelo le ntlafetseng le ho fokotsa tšebeliso ea matla, e leng ea bohlokoa bakeng sa lisebelisoa tsa motlakase tsa morao-rao.
Mekhoa e tsoetseng pele ea tlhahiso e sebelisoang ke Semicera e tiisa tlhahiso ea li-wafers tsa SOI tse nang le ts'ebetso e ntle le e tsitsitseng. Boleng bona bo bohlokoa bakeng sa lits'ebetso tsa likhokahano tsa mehala, likoloi, le lisebelisoa tsa elektroniki tsa bareki, moo ho hlokahalang likarolo tse tšepahalang le tse sebetsang hantle.
Ntle le melemo ea bona ea motlakase, li-wafers tsa SOI tsa Semicera li fana ka mocheso o phahameng oa mocheso, ho matlafatsa mocheso oa mocheso le botsitso ho lisebelisoa tse phahameng le tse matla haholo. Ts'ebetso ena e bohlokoa haholo lits'ebetsong tse kenyelletsang tlhahiso e kholo ea mocheso 'me e hloka taolo e sebetsang ea mocheso.
Ka ho khetha Semicera's Silicon On Insulator Wafer, o tsetela ho sehlahisoa se tšehetsang tsoelo-pele ea mahlale a morao-rao. Boitlamo ba rona ba boleng le boqapi bo netefatsa hore li-wafers tsa rona tsa SOI li fihlela litlhoko tse matla tsa indasteri ea semiconductor ea kajeno, e fana ka motheo oa lisebelisoa tsa elektroniki tsa moloko o latelang.
| Lintho | Tlhahiso | Patlisiso | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
| Litekanyetso tsa Motlakase | |||
| Dopant | n-mofuta oa Nitrojene | ||
| Ho hanyetsa | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Botenya | 350±25 μm | ||
| Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
| Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
| Folete ea bobeli | Ha ho letho | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Sebopeho | |||
| Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
| Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Boleng ba Pele | |||
| Pele | Si | ||
| Qetello ea bokaholimo | Si-face CMP | ||
| Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
| Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
| Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
| Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
| Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
| Ho tšoaea ka laser ka pele | Ha ho letho | ||
| Boleng ba Morao | |||
| Qetello ea morao | C-sefahleho sa CMP | ||
| Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
| Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
| Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
| Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
| Qetello | |||
| Qetello | Chamfer | ||
| Sephutheloana | |||
| Sephutheloana | Epi e loketse ho paka ka vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
| *Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. | |||
