Silicon ho li-wafers tsa insulatorho tsoa ho Semicera li etselitsoe ho fihlela tlhoko e ntseng e hola ea litharollo tsa semiconductor tse sebetsang hantle haholo. Li-wafers tsa rona tsa SOI li fana ka ts'ebetso e phahameng ea motlakase le ho fokotsa matla a sesebelisoa sa parasitic, e leng se etsang hore e be tse loketseng lits'ebetso tse tsoetseng pele joalo ka lisebelisoa tsa MEMS, li-sensor le li-circuits tse kopaneng. Tsebo ea Semicera ea tlhahiso ea liphaphatha e tiisa hore e 'ngoe le e 'ngoeSephaphatha sa SOIe fana ka liphetho tse tšepahalang, tsa boleng bo holimo bakeng sa litlhoko tsa hau tsa theknoloji ea moloko o latelang.
Ea ronaSilicon ho li-wafers tsa insulatorfana ka tekanyo e nepahetseng pakeng tsa ts'ebetso ea litšenyehelo le ts'ebetso. Ha litšenyehelo tsa soi wafer li ntse li eketseha, li-wafer tsena li sebelisoa haholo liindastering tse fapaneng, ho kenyeletsoa li-microelectronics le optoelectronics. Ts'ebetso ea tlhahiso ea boleng bo holimo ea Semicera e tiisa tlamahano e holimo le ho ts'oana, e etsa hore e tšoanelehe bakeng sa lits'ebetso tse fapaneng, ho tloha ho li-wafers tsa SOI ho isa ho li-wafers tse tloaelehileng tsa silicon.
Likarolo tsa Bohlokoa:
•Li-wafers tsa boleng bo holimo tsa SOI tse ntlafalitsoeng bakeng sa ts'ebetso ho MEMS le lits'ebetso tse ling.
•Litsenyehelo tsa tlholisano ea soi wafer bakeng sa likhoebo tse batlang litharollo tse tsoetseng pele ntle le ho beha boleng.
•E loketse mahlale a morao-rao, a fanang ka karohano e ntlafalitsoeng ea motlakase le ts'ebetso e ntle ho silicon lits'ebetsong tsa insulator.
Ea ronaSilicon ho li-wafers tsa insulatorli etselitsoe ho fana ka tharollo ea ts'ebetso e phahameng, ho ts'ehetsa leqhubu le latelang la mahlale a theknoloji ea semiconductor. Hore na o sebetsa ka cavityliphaphatha tsa SOI, lisebelisoa tsa MEMS, kapa silicon holim'a likarolo tsa insulator, Semicera e fana ka liphaephe tse finyellang litekanyetso tse phahameng ka ho fetisisa indastering.
| Lintho | Tlhahiso | Patlisiso | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
| Litekanyetso tsa Motlakase | |||
| Dopant | n-mofuta oa Nitrojene | ||
| Ho hanyetsa | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Botenya | 350±25 μm | ||
| Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
| Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
| Folete ea bobeli | Ha ho letho | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Sebopeho | |||
| Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
| Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Boleng ba Pele | |||
| Pele | Si | ||
| Qetello ea bokaholimo | Si-face CMP | ||
| Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
| Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
| Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
| Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
| Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
| Ho tšoaea ka laser ka pele | Ha ho letho | ||
| Boleng ba Morao | |||
| Qetello ea morao | C-sefahleho sa CMP | ||
| Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
| Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
| Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
| Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
| Qetello | |||
| Qetello | Chamfer | ||
| Sephutheloana | |||
| Sephutheloana | Epi e loketse ho paka ka vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
| *Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. | |||
