Semicera Silicon Substrates e etselitsoe ho fihlela litlhoko tse matla tsa indasteri ea semiconductor, e fanang ka boleng bo ke keng ba bapisoa le ho nepahala. Li-substrates tsena li fana ka motheo o tšepahalang bakeng sa lits'ebetso tse fapaneng, ho tloha ho lipotoloho tse kopaneng ho isa liseleng tsa photovoltaic, ho netefatsa ts'ebetso e nepahetseng le bophelo bo bolelele.
Bohloeki bo phahameng ba Semicera Silicon Substrates bo netefatsa bofokoli bo fokolang le litšobotsi tse phahameng tsa motlakase, tse bohlokoa bakeng sa tlhahiso ea likarolo tsa elektroniki tse sebetsang hantle haholo. Boemo bona ba bohloeki bo thusa ho fokotsa tahlehelo ea matla le ho ntlafatsa katleho e akaretsang ea lisebelisoa tsa semiconductor.
Semicera e sebelisa mekhoa ea morao-rao ea ho etsa lihlahisoa ho hlahisa li-silicon substrates tse nang le ho tšoana ho ikhethang le ho bata. Ho nepahala hona ho bohlokoa bakeng sa ho fumana liphetho tse tsitsitseng tsa tlhahiso ea semiconductor, moo esita le phapang e nyane e ka amang ts'ebetso ea sesebelisoa le tlhahiso.
E fumaneha ka boholo le litlhaloso tse fapaneng, Semicera Silicon Substrates e hlokomela litlhoko tse fapaneng tsa indasteri. Hore na o ntse o nts'etsapele li-microprocessor kapa liphanele tsa letsatsi, li-substrates tsena li fana ka maemo le ts'epahalo e hlokahalang bakeng sa ts'ebeliso ea hau e ikhethileng.
Semicera e ikemiselitse ho tšehetsa boqapi le katleho indastering ea semiconductor. Ka ho fana ka likaroloana tsa silicon tsa boleng bo holimo, re thusa bahlahisi ho sutumelletsa meeli ea theknoloji, ba fana ka lihlahisoa tse fihlelang litlhoko tse tsoelang pele tsa mmaraka. Tšepa Semicera bakeng sa litharollo tsa hau tsa elektroniki le tsa photovoltaic tsa moloko o latelang.
| Lintho | Tlhahiso | Patlisiso | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
| Litekanyetso tsa Motlakase | |||
| Dopant | n-mofuta oa Nitrojene | ||
| Ho hanyetsa | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Botenya | 350±25 μm | ||
| Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
| Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
| Folete ea bobeli | Ha ho letho | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Sebopeho | |||
| Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
| Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Boleng ba Pele | |||
| Pele | Si | ||
| Qetello ea bokaholimo | Si-face CMP | ||
| Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
| Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
| Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
| Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
| Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
| Ho tšoaea ka laser ka pele | Ha ho letho | ||
| Boleng ba Morao | |||
| Qetello ea morao | C-sefahleho sa CMP | ||
| Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
| Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
| Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
| Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
| Qetello | |||
| Qetello | Chamfer | ||
| Sephutheloana | |||
| Sephutheloana | Epi-reading ka sephutheloana sa vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
| *Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. | |||
