Semicera Silicon Wafers e entsoe ka boqhetseke ho sebetsa e le motheo oa lisebelisoa tse ngata tsa semiconductor, ho tloha ho li-microprocessors ho isa liseleng tsa photovoltaic. Li-wafers tsena li entsoe ka nepo le bohloeki bo phahameng, tse netefatsang ts'ebetso e nepahetseng lits'ebetsong tse fapaneng tsa elektroniki.
E entsoe ka mekhoa e tsoetseng pele, Semicera Silicon Wafers e bonts'a ho bata le ho ts'oana ho ikhethang, tse bohlokoa bakeng sa ho fumana chai e ngata molemong oa ho etsa semiconductor. Boemo bona ba ho nepahala bo thusa ho fokotsa liphoso le ho ntlafatsa katleho ea likarolo tsa elektroniki.
Boleng bo phahameng ba Semicera Silicon Wafers bo bonahala litšobotsing tsa bona tsa motlakase, tse tlatsetsang ts'ebetsong e ntlafetseng ea lisebelisoa tsa semiconductor. Ka maemo a tlase a litšila le boleng bo phahameng ba kristale, liphaphatha tsena li fana ka sethala se loketseng bakeng sa ho nts'etsapele lisebelisoa tsa elektronike tse sebetsang hantle.
E fumaneha ka boholo le litlhaloso tse fapaneng, Semicera Silicon Wafers e ka hlophisoa ho fihlela litlhoko tse ikhethileng tsa liindasteri tse fapaneng, ho kenyeletsoa likhomphutha, likhokahano tsa mehala le matla a ka nchafatsoang. Ebang ke bakeng sa tlhahiso e kholo kapa lipatlisiso tse ikhethang, li-wafers tsena li fana ka liphetho tse tšepahalang.
Semicera e ikemiseditse ho tshehetsa kgolo le popontshwa ya indasteri ya semiconductor ka ho fana ka diphaephe tsa silicon tsa boleng bo phahameng tse fihlelang maemo a phahameng ka ho fetisisa a indasteri. Ka ho shebana le ho nepahala le ho ts'epahala, Semicera e thusa bahlahisi ho sutumelletsa meeli ea thekenoloji, ho netefatsa hore lihlahisoa tsa bona li lula li le ka pele 'marakeng.
| Lintho | Tlhahiso | Patlisiso | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
| Litekanyetso tsa Motlakase | |||
| Dopant | n-mofuta oa Nitrojene | ||
| Ho hanyetsa | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Botenya | 350±25 μm | ||
| Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
| Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
| Folete ea bobeli | Ha ho letho | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Sebopeho | |||
| Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
| Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Boleng ba Pele | |||
| Pele | Si | ||
| Qetello ea bokaholimo | Si-face CMP | ||
| Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
| Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
| Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
| Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
| Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
| Ho tšoaea ka laser ka pele | Ha ho letho | ||
| Boleng ba Morao | |||
| Qetello ea morao | C-sefahleho sa CMP | ||
| Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
| Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
| Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
| Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
| Qetello | |||
| Qetello | Chamfer | ||
| Sephutheloana | |||
| Sephutheloana | Epi e loketse ho paka ka vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
| *Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. | |||
