Semicera's SiN Ceramics Plain Substrates e fana ka tharollo ea ts'ebetso e phahameng bakeng sa mefuta e fapaneng ea lisebelisoa tsa elektroniki le tsa indasteri. Li tsejoa ka mokhoa oa tsona o motle oa ho tsamaisa mocheso le matla a mochine, li-substrates tsena li netefatsa ts'ebetso e ka tšeptjoang libakeng tse hlokang.
Li-ceramics tsa rona tsa SiN (Silicon Nitride) li etselitsoe ho sebetsana le mocheso o feteletseng le maemo a khatello ea maikutlo, ho li etsa hore li tšoanelehe bakeng sa lisebelisoa tsa elektronike tse matla le lisebelisoa tse tsoetseng pele tsa semiconductor. Ho tšoarella ha bona le ho hanyetsa mocheso oa mocheso ho etsa hore e be tse loketseng ho sebelisoa lits'ebetsong moo ho ts'epahala le ts'ebetso e leng tsa bohlokoa.
Mekhoa e nepahetseng ea tlhahiso ea Semicera e netefatsa hore substrate e 'ngoe le e' ngoe e thota e kopana le litekanyetso tse thata tsa boleng. Sena se fella ka li-substrates tse nang le botenya bo tsitsitseng le boleng ba bokaholimo, tse bohlokoa bakeng sa ho fihlela ts'ebetso e nepahetseng likopanong le lits'ebetsong tsa elektroniki.
Ntle le melemo ea bona ea mocheso le mochini, SiN Ceramics Plain Substrates e fana ka thepa e ntle haholo ea ho kenya motlakase. Sena se tiisa tšitiso e fokolang ea motlakase 'me se kenya letsoho ho tsitsitseng le ho sebetsa hantle ha likarolo tsa elektronike, ho ntlafatsa bophelo ba bona ba ts'ebetso.
Ka ho khetha Semicera's SiN Ceramics Plain Substrates, u khetha sehlahisoa se kopanyang mahlale a tsoetseng pele a mahlale le tlhahiso ea maemo a holimo. Boitlamo ba rona ba boleng le boqapi bo tiisa hore o fumana li-substrates tse fihlelang maemo a holimo ka ho fetisisa a indasteri le ho tšehetsa katleho ea merero ea hau ea theknoloji e tsoetseng pele.
| Lintho | Tlhahiso | Patlisiso | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
| Litekanyetso tsa Motlakase | |||
| Dopant | n-mofuta oa Nitrojene | ||
| Ho hanyetsa | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Botenya | 350±25 μm | ||
| Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
| Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
| Folete ea bobeli | Ha ho letho | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Sebopeho | |||
| Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
| Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Boleng ba Pele | |||
| Pele | Si | ||
| Qetello ea bokaholimo | Si-face CMP | ||
| Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
| Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
| Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
| Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
| Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
| Ho tšoaea ka laser ka pele | Ha ho letho | ||
| Boleng ba Morao | |||
| Qetello ea morao | C-sefahleho sa CMP | ||
| Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
| Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
| Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
| Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
| Qetello | |||
| Qetello | Chamfer | ||
| Sephutheloana | |||
| Sephutheloana | Epi-reading ka sephutheloana sa vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
| *Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. | |||
