Semicera's SOI Wafer (Silicon On Insulator) e etselitsoe ho fana ka karohano e phahameng ea motlakase le ts'ebetso ea mocheso. Sebopeho sena se secha, se nang le lesela la silicon holim'a lesela le sireletsang tšireletso, se tiisa ts'ebetso e ntlafetseng ea lisebelisoa le ho fokotsa tšebeliso ea matla, e leng se etsang hore e be se loketseng bakeng sa mefuta e fapaneng ea lisebelisoa tsa theknoloji e phahameng.
Li-wafers tsa rona tsa SOI li fana ka melemo e ikhethang bakeng sa lipotoloho tse kopantsoeng ka ho fokotsa matla a likokoana-hloko le ho ntlafatsa lebelo la lisebelisoa le katleho. Sena se bohlokoa bakeng sa lisebelisoa tsa elektroniki tsa sejoale-joale, moo ts'ebetso e phahameng le ts'ebetso ea matla e leng bohlokoa bakeng sa lits'ebetso tsa bareki le tsa indasteri.
Semicera e sebelisa mekhoa e tsoetseng pele ea tlhahiso ho hlahisa li-wafers tsa SOI tse nang le boleng bo tsitsitseng le ho tšepahala. Li-wafers tsena li fana ka tšireletso e ntle ea mocheso, e leng se etsang hore li tšoanelehe ho sebelisoa libakeng tseo ho tsona ho tšoenngoang ke ho qhalana ha mocheso, joalo ka lisebelisoa tsa elektronike tse matla haholo le tsamaiso ea matla.
Tšebeliso ea li-wafers tsa SOI ha ho etsoa lihlahisoa tsa semiconductor li lumella nts'etsopele ea lichifi tse nyane, tse potlakileng le tse tšepahalang. Boitlamo ba Semicera ba boenjineri bo nepahetseng bo netefatsa hore li-wafers tsa rona tsa SOI li fihlela maemo a holimo a hlokahalang bakeng sa mahlale a tsoetseng pele mafapheng a kang likhokahano tsa mehala, likoloi le lisebelisoa tsa elektroniki tsa bareki.
Ho khetha SOI Wafer ea Semicera ho bolela ho tsetela ho sehlahisoa se tšehetsang tsoelo-pele ea theknoloji ea elektroniki le ea microelectronic. Li-wafers tsa rona li etselitsoe ho fana ka ts'ebetso e ntlafetseng le ho tšoarella, ho kenya letsoho katlehong ea merero ea hau ea theknoloji e phahameng le ho netefatsa hore u lula u le ka pele ho boqapi.
| Lintho | Tlhahiso | Patlisiso | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
| Litekanyetso tsa Motlakase | |||
| Dopant | n-mofuta oa Nitrojene | ||
| Ho hanyetsa | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Botenya | 350±25 μm | ||
| Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
| Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
| Folete ea bobeli | Ha ho letho | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Sebopeho | |||
| Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
| Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Boleng ba Pele | |||
| Pele | Si | ||
| Qetello ea bokaholimo | Si-face CMP | ||
| Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
| Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
| Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
| Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
| Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
| Ho tšoaea ka laser ka pele | Ha ho letho | ||
| Boleng ba Morao | |||
| Qetello ea morao | C-sefahleho sa CMP | ||
| Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
| Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
| Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
| Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
| Qetello | |||
| Qetello | Chamfer | ||
| Sephutheloana | |||
| Sephutheloana | Epi-reading ka sephutheloana sa vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
| *Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. | |||
