Semicera e hlahisa indasteri e etelletseng peleBajari ba Wafer, e etselitsoeng ho fana ka tšireletso e phahameng le lipalangoang tse se nang moeli tsa liphaephe tse bonojoana tsa semiconductor ho pholletsa le mekhahlelo e fapaneng ea ts'ebetso ea tlhahiso. Ea ronaBajari ba Waferli entsoe ka makhethe ho fihlela litlhoko tse thata tsa masela a semiconductor a sejoale-joale, ho netefatsa hore botšepehi le boleng ba liphaephe tsa hau li lula li le teng ka linako tsohle.
Likarolo tsa Bohlokoa:
• Kaho ea Materiale ea Pele:E entsoe ka thepa ea boleng bo holimo, e hananang le tšilafalo e tiisang ho tšoarella le ho phela nako e telele, e leng se etsang hore e be sebaka se loketseng tikoloho ea likamore tse hloekileng.
•Moralo o nepahetseng:E fana ka tlhophiso e nepahetseng ea slot le mekhoa e bolokehileng ea ho ts'oara ho thibela ho thella le ho senyeha ha sekoti nakong ea ho ts'oaroa le ho tsamaisa.
•Tšebelisano e fapaneng:E amohela mefuta e mengata e fapaneng ea boholo le botenya, e fana ka maemo a bonolo bakeng sa lits'ebetso tse fapaneng tsa semiconductor.
•Ho sebetsana le Ergonomic:Moralo o bobebe le o bonolo oa basebelisi o thusa ho jarolla le ho laolla habonolo, ho ntlafatsa ts'ebetso e sebetsang hantle le ho fokotsa nako ea ho sebetsa.
•Likhetho tseo u ka li khethang:E fana ka tlhophiso ho fihlela litlhoko tse ikhethileng, ho kenyelletsa khetho ea thepa, litokiso tsa boholo, le lileibole bakeng sa kopanyo e ntlafalitsoeng ea phallo ea mosebetsi.
Ntlafatsa ts'ebetso ea hau ea tlhahiso ea semiconductor ka Semicera'sBajari ba Wafer, tharollo e phethahetseng bakeng sa ho sireletsa liphaphatha tsa hau khahlanong le tšoaetso le tšenyo ea mochini. Tšepa boitlamo ba rona ba boleng le boqapi ba ho fana ka lihlahisoa tse sa fihlelleng feela empa li feta maemo a indasteri, ho netefatsa hore ts'ebetso ea hau e tsamaea hantle le ka bokhabane.
| Lintho | Tlhahiso | Patlisiso | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
| Litekanyetso tsa Motlakase | |||
| Dopant | n-mofuta oa Nitrojene | ||
| Ho hanyetsa | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Botenya | 350±25 μm | ||
| Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
| Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
| Folete ea bobeli | Ha ho letho | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Sebopeho | |||
| Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
| Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Boleng ba Pele | |||
| Pele | Si | ||
| Qetello ea bokaholimo | Si-face CMP | ||
| Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
| Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
| Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
| Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
| Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
| Ho tšoaea ka laser ka pele | Ha ho letho | ||
| Boleng ba Morao | |||
| Qetello ea morao | C-sefahleho sa CMP | ||
| Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
| Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
| Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
| Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
| Qetello | |||
| Qetello | Chamfer | ||
| Sephutheloana | |||
| Sephutheloana | Epi e loketse ho paka ka vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
| *Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. | |||
