Semicera e hlahisaMopalami oa Cassette ea Wafer, tharollo ea bohlokoa bakeng sa ts'ebetso e sireletsehileng le e sebetsang ea li-wafers tsa semiconductor. Sesebelisoa sena se etselitsoe ho fihlela litlhoko tse thata tsa indasteri ea semiconductor, ho netefatsa ts'ireletso le bots'epehi ba li-wafers tsa hau ts'ebetsong eohle ea tlhahiso.
Likarolo tsa Bohlokoa:
•Kaho e Matla:TheMopalami oa Cassette ea Wafere hahiloe ka thepa ea boleng bo holimo, e tšoarellang e mamellang maemo a thata a tikoloho ea semiconductor, e fanang ka tšireletso e tšepahalang khahlanong le tšilafalo le tšenyo ea 'mele.
•Tsepamiso e nepahetseng:E etselitsoe bakeng sa ho tsamaisana hantle ha li-wafer, sesebelisoa sena se netefatsa hore li-wafers li ts'oaroa ka mokhoa o sireletsehileng, ho fokotsa kotsi ea ho se tsamaisane hantle kapa tšenyo nakong ea lipalangoang.
•Ho sebetsa ha bonolo:E etselitsoe ergonomically bakeng sa ts'ebeliso e bonolo, sesebelisoa se nolofatsa ts'ebetso ea ho kenya le ho laolla, ho ntlafatsa ts'ebetso ea ts'ebetso libakeng tse hloekileng tsa phaposi.
•Tšebelisano:E lumellana le mefuta e mengata e fapaneng ea boholo le mefuta ea li-wafer, e e etsa hore e khonehe bakeng sa litlhoko tse fapaneng tsa tlhahiso ea semiconductor.
Fumana ts'ireletso le boiketlo bo ke keng ba lekanngoa le Semicera'sMopalami oa Cassette ea Wafer. Sesebelisoa sa rona se etselitsoe ho fihlela litekanyetso tse phahameng ka ho fetisisa tsa tlhahiso ea semiconductor, ho netefatsa hore liphaephe tsa hau li lula li le maemong a hloekileng ho tloha qalong ho fihlela qetellong. Tšepa Semicera ho fana ka boleng le ts'epahalo eo u e hlokang bakeng sa lits'ebetso tsa hau tsa bohlokoahali.
| Lintho | Tlhahiso | Patlisiso | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
| Litekanyetso tsa Motlakase | |||
| Dopant | n-mofuta oa Nitrojene | ||
| Ho hanyetsa | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Botenya | 350±25 μm | ||
| Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
| Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
| Folete ea bobeli | Ha ho letho | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Sebopeho | |||
| Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
| Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Boleng ba Pele | |||
| Pele | Si | ||
| Qetello ea bokaholimo | Si-face CMP | ||
| Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
| Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
| Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
| Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
| Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
| Ho tšoaea ka laser ka pele | Ha ho letho | ||
| Boleng ba Morao | |||
| Qetello ea morao | C-sefahleho sa CMP | ||
| Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
| Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
| Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
| Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
| Qetello | |||
| Qetello | Chamfer | ||
| Sephutheloana | |||
| Sephutheloana | Epi e loketse ho paka ka vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
| *Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. | |||
