Melemo ea ts'ebetso ea LMJ
Bofokoli ba tlhaho ba ts'ebetso ea kamehla ea laser bo ka hlōloa ka tšebeliso e bohlale ea theknoloji ea laser Laser micro jet (LMJ) ho phatlalatsa litšobotsi tsa optical tsa metsi le moea. Theknoloji ena e lumella maqhubu a laser hore a bonahatsoe ka ho feletseng ka jete ea metsi a hloekileng a phahameng ka mokhoa o sa tsitsang ho fihla sebakeng sa machining joaloka optical fiber.
Likarolo tsa mantlha tsa theknoloji ea LMJ ke:
1. Lebone la laser ke sebopeho sa columnar (parallel).
2. Leqhubu la laser le fetisoa ka jete ea metsi joaloka fiber optical, ntle le tšitiso leha e le efe ea tikoloho.
3. Lebone la laser le lebisitsoe ho thepa ea LMJ, 'me bophahamo ba sebaka se entsoeng ka mochine ha bo fetohe nakong ea ts'ebetso eohle ea ts'ebetso, kahoo ha ho hlokahale hore e tsoele pele ho lebisa tlhokomelo le phetoho ea botebo ba ts'ebetso nakong ea ts'ebetso.
4. Hloekisa bokaholimo u sa khaotse.
5. Ntle le ho ablation ea thepa ea workpiece ka laser pulse e 'ngoe le e' ngoe, nako e 'ngoe le e' ngoe ea yuniti ho tloha qalong ea sekhahla se seng le se seng ho ea ho sekhahla se latelang, thepa e sebetsitsoeng e sebakeng sa metsi a pholileng a nako ea 'nete bakeng sa hoo e ka bang 99% ea nako. , e batlang e felisa sebaka se amehileng ke mocheso le lera la remelt, empa e boloka ts'ebetso e phahameng ea ts'ebetso.
Tlhaloso e akaretsang | LCSA-100 | LCSA-200 |
Molumo oa countertop | 125 x 200 x 100 | 460×460×300 |
Linear axis XY | Enjene ea mola. Enjene ea mola | Enjene ea mola. Enjene ea mola |
Linear axis Z | 100 | 300 |
Ho beha ho nepahala μm | +/ - 5 | +/- 3 |
Ho nepahala ha maemo a phetoang μm | +/- 2 | +/- 1 |
Ho potlakisa G | 0.5 | 1 |
Taolo ya dipalo | 3-axis | 3-axis |
Laser |
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Mofuta oa laser | DPSS Nd: YAG | DPSS Nd: YAG, ho otla ha pelo |
Wavelength nm | 532/1064 | 532/1064 |
Matla a lekantsoeng W | 50/100/200 | 200/400 |
Jete ea metsi |
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Nozzle bophara μm | 25-80 | 25-80 |
Nozzle khatello ea bar | 100-600 | 0-600 |
Boholo/ Boima ba mmele |
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Litekanyo (Mochini) (W x L x H) | 1050 x 800 x 1870 | 1200 x 1200 x 2000 |
Litekanyo (khabinete ea taolo) (W x L x H) | 700 x 2300 x 1600 | 700 x 2300 x 1600 |
Boima (thepa) kg | 1170 | 2500-3000 |
Boima (taolo ea khabinete) lik'hilograma | 700-750 | 700-750 |
Tšebeliso e felletseng ea matla |
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Input | AC 230 V +6%/ -10%, unidirectional 50/60 Hz ±1% | AC 400 V +6%/-10%, 3-phase50/60 Hz ±1% |
Boleng ba tlhoro | 2.5kVA | 2.5kVA |
Join | 10 m thapo ea matla: P+N+E, 1.5 mm2 | 10 m thapo ea matla: P+N+E, 1.5 mm2 |
Lethathamo la ts'ebeliso ea basebelisi ba indasteri ea semiconductor | ≤4 lisenthimithara tse pota-potileng ≤4 lilae tsa ingot tsa lisenthimithara tse 4 ≤4 lisenthimithara tse 4 tsa ho ngola
| ≤6 lisenthimithara tse pota-potileng ≤6 lilae tsa ingot tsa inch ≤6 lisenthimithara tse 6 tsa ho ngola Mochini o kopana le boleng ba 8-inch / slicing / slicing theory, mme liphetho tse sebetsang li hloka ho ntlafatsoa leano la ho itšeha. |