Lisebelisoa tsa laser microjet cutting (LMJ) li ka sebelisoa indastering ea semiconductor

Tlhaloso e Khutšoanyane:

Laser microjet technology (LMJ) ke mokhoa oa ho sebetsa oa laser o kopanyang laser le jete ea metsi "e le tšesaane joalo ka moriri", 'me e tataisa beam ea laser hantle sebakeng sa ts'ebetso ka ho bonts'a kakaretso ea pulse ka jet ea metsi a manyane ka tsela. e ts'oanang le fiber ea setso ea optical.Jete ea metsi e tsoela pele ho pholisa sebaka sa ho itšeha 'me ka katleho e tlosa litšila tsa ho sebetsa.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Melemo ea ts'ebetso ea LMJ

Bofokoli ba tlhaho ba ts'ebetso ea kamehla ea laser bo ka hlōloa ka tšebeliso e bohlale ea theknoloji ea laser Laser micro jet (LMJ) ho phatlalatsa litšobotsi tsa optical tsa metsi le moea.Theknoloji ena e lumella maqhubu a laser hore a bonahatsoe ka ho feletseng ka jete ea metsi a hloekileng a phahameng ka mokhoa o sa tsitsang ho fihla sebakeng sa machining joaloka optical fiber.

Lisebelisoa tsa ho sebetsa ka laser ea Microjet-2-3

Likarolo tsa mantlha tsa theknoloji ea LMJ ke:

1. Lebone la laser ke sebopeho sa columnar (parallel).

2. Leqhubu la laser le fetisoa ka jete ea metsi joaloka fiber optical, ntle le tšitiso leha e le efe ea tikoloho.

3. Lebone la laser le lebisitsoe ho thepa ea LMJ, 'me bophahamo ba sebaka se entsoeng ka mochine ha bo fetohe nakong ea ts'ebetso eohle ea ts'ebetso, kahoo ha ho hlokahale hore e tsoele pele ho lebisa tlhokomelo le phetoho ea botebo ba ts'ebetso nakong ea ts'ebetso.

4. Hloekisa bokaholimo u sa khaotse.

5. Ntle le ho ablation ea thepa ea workpiece ka laser pulse e 'ngoe le e' ngoe, nako e 'ngoe le e' ngoe ea yuniti ho tloha qalong ea sekhahla se seng le se seng ho ea ho sekhahla se latelang, thepa e sebetsitsoeng e sebakeng sa metsi a pholileng a nako ea 'nete bakeng sa hoo e ka bang 99% ea nako. , e batlang e felisa sebaka se amehileng ke mocheso le lera la remelt, empa e boloka ts'ebetso e phahameng ea ts'ebetso.

Tlhaloso e akaretsang	LCSA-100	LCSA-200
Molumo oa countertop	125 x 200 x 100	460×460×300
Linear axis XY	Enjene ea mola.Enjene ea mola	Enjene ea mola.Enjene ea mola
Linear axis Z	100	300
Ho beha ho nepahala μm	+/ - 5	+/- 3
Ho nepahala ha maemo a phetoang μm	+/- 2	+/- 1
Ho potlakisa G	0.5	1
Taolo ya dipalo	3-axis	3-axis
Laser
Mofuta oa laser	DPSS Nd: YAG	DPSS Nd: YAG, ho otla ha pelo
Wavelength nm	532/1064	532/1064
Matla a lekantsoeng W	50/100/200	200/400
Jete ea metsi
Nozzle bophara μm	25-80	25-80
Nozzle khatello ea bar	100-600	0-600
Boholo/ Boima ba mmele
Litekanyo (Mochini) (W x L x H)	1050 x 800 x 1870	1200 x 1200 x 2000
Litekanyo (khabinete ea taolo) (W x L x H)	700 x 2300 x 1600	700 x 2300 x 1600
Boima (thepa) kg	1170	2500-3000
Boima (taolo ea khabinete) lik'hilograma	700-750	700-750
Tšebeliso e felletseng ea matla
Input	AC 230 V +6%/ -10%, unidirectional 50/60 Hz ±1%	AC 400 V +6%/-10%, 3-phase50/60 Hz ±1%
Boleng ba tlhoro	2.5kVA	2.5kVA
Join	10 m thapo ea matla: P+N+E, 1.5 mm2	10 m thapo ea matla: P+N+E, 1.5 mm2
Lethathamo la ts'ebeliso ea basebelisi ba indasteri ea semiconductor	≤4 lisenthimithara tse pota-potileng ≤4 lilae tsa ingot tsa lisenthimithara tse 4 ≤4 lisenthimithara tse 4 tsa ho ngola	≤6 lisenthimithara tse pota-potileng ≤6 lilae tsa ingot tsa inch ≤6 lisenthimithara tse 6 tsa ho ngola Mochini o kopana le boleng ba 8-inch / slicing / slicing theory, mme liphetho tse sebetsang li hloka ho ntlafatsoa leano la ho itšeha.