Semicerae fana ka motlotloGa2O3Epitaxy, tharollo ea morao-rao e etselitsoeng ho sutumelletsa meeli ea matla a elektronike le optoelectronics. Theknoloji ena e tsoetseng pele ea epitaxial e sebelisa thepa e ikhethang ea Gallium Oxide (Ga2O3) ho fana ka ts'ebetso e phahameng ho likopo tse batlang.
Likarolo tsa Bohlokoa:
• Ikhethang Wide Bandgap: Ga2O3Epitaxye na le bandgap e pharalletseng haholo, e lumellang hore ho be le li-voltage tse phahameng haholo le ts'ebetso e sebetsang libakeng tse matla a phahameng.
•High Thermal Conductivity: Lera la epitaxial le fana ka conductivity e babatsehang ea mocheso, ho netefatsa ts'ebetso e tsitsitseng esita le tlas'a maemo a phahameng a mocheso, ho etsa hore e be se loketseng bakeng sa lisebelisoa tse phahameng tsa maqhubu.
•Boleng bo Phahameng ba Lintho: Finyella boleng bo phahameng ba kristale bo nang le mefokolo e fokolang, ho netefatsa ts'ebetso e nepahetseng ea sesebelisoa le bophelo bo bolelele, haholo lits'ebetsong tse mahlonoko tse kang li-transistors tsa matla le li-detectors tsa UV.
•Mefuta-futa ea Likopo: E loketse ka ho feletseng bakeng sa lisebelisoa tsa elektronike tsa matla, lisebelisoa tsa RF, le optoelectronics, e fanang ka motheo o tšepahalang oa lisebelisoa tsa semiconductor tsa moloko o latelang.
Sibolla bokhoni baGa2O3Epitaxyka litharollo tse ncha tsa Semicera. Lihlahisoa tsa rona tsa epitaxial li etselitsoe ho finyella litekanyetso tse phahameng ka ho fetisisa tsa boleng le ts'ebetso, ho nolofalletsa lisebelisoa tsa hau ho sebetsa ka katleho e kholo le ho tšepahala. Khetha Semicera bakeng sa theknoloji ea semiconductor e tsoetseng pele.
| Lintho | Tlhahiso | Patlisiso | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Phoso ea ho shebana le bokaholimo | <11-20>4±0.15° | ||
| Litekanyetso tsa Motlakase | |||
| Dopant | n-mofuta oa Nitrojene | ||
| Ho hanyetsa | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Botenya | 350±25 μm | ||
| Boemo ba mantlha bo bataletseng | [1-100]±5° | ||
| Bolelele ba pele bo bataletseng | 47.5±1.5mm | ||
| Folete ea bobeli | Ha ho letho | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Inamela | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Sebopeho | |||
| Boima ba micropipe | <1 e/cm2 | <10 e/cm2 | <15 e/cm2 |
| Litšila tsa tšepe | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Boleng ba Pele | |||
| Pele | Si | ||
| Qetello ea bokaholimo | Si-face CMP | ||
| Likaroloana | ≤60ea/wafer (boholo ≥0.3μm) | NA | |
| Mengwapo | ≤5ea/mm. Bolelele ba kakaretso ≤Diameter | Bolelele bo akaretsang≤2*Diameter | NA |
| Lekhapetla la lamunu/makoti/matheba/maphatso/mapetso/tshilafatso | Ha ho letho | NA | |
| Li-edge chips/indents/fracture/hex plates | Ha ho letho | ||
| Libaka tsa polytype | Ha ho letho | Kakaretso≤20% | Kakaretso≤30% |
| Ho tšoaea ka laser ka pele | Ha ho letho | ||
| Boleng ba Morao | |||
| Qetello ea morao | C-sefahleho sa CMP | ||
| Mengwapo | ≤5ea/mm, bolelele bo akaretsang≤2* bophara | NA | |
| Litšitiso tse ka morao (li-chips / indents) | Ha ho letho | ||
| Bokhopo ba mokokotlo | Ra≤0.2nm (5μm*5μm) | ||
| Ho tšoaea ka morao laser | 1 mm (ho tloha pheletsong e ka holimo) | ||
| Qetello | |||
| Qetello | Chamfer | ||
| Sephutheloana | |||
| Sephutheloana | Epi-reading ka sephutheloana sa vacuum Sephutheloana sa lik'hasete tse nang le liphaephe tse ngata | ||
| *Lintlha: "NA" e bolela hore ha ho na kopo Lintho tse sa boleloang li ka lebisa ho SEMI-STD. | |||
