Li-substrates tsa GaAs li arotsoe ka conductive le semi-insulating, tse sebelisoang haholo ka laser (LD), semiconductor light-emitting diode (LED), near-infrared laser, quantum well-high-power laser le liphanele tsa letsatsi tse sebetsang hantle haholo.HEMT le HBT chips bakeng sa radar, microwave, millimeter wave kapa likhomphutha tsa lebelo le phahameng haholo le puisano ea optical;Lisebelisoa tsa maqhubu a seea-le-moea bakeng sa puisano e se nang mohala, 4G, 5G, puisano ea sathelaete, WLAN.
Haufinyane tjena, li-substrates tsa gallium arsenide le tsona li hatetse pele haholo ho mini-LED, Micro-LED, le LED e khubelu, 'me li sebelisoa haholo lisebelisoa tse aparoang tsa AR/VR.
Diameter | 50 limilimithara |75 limilimithara |100 limilimithara |150 limilimithara |
Mokhoa oa Kholo | LEC液封直拉法 |
Botenya ba Wafer | 350mm ~ 625 um |
Boitloaelo | <100> / <111> / <110> kapa tse ling |
Mofuta oa Conductive | P – mofuta / N – mofuta / Semi-insulating |
Mofuta/Dopant | Zn / Si / undoped |
Boikemisetso ba Mojari | 1E17 ~ 5E19 cm-3 |
Resistivity ho RT | ≥1E7 bakeng sa SI |
Motsamao | ≥4000 |
EPD( Etch Pit Density) | 100~1E5 |
TTV | ≤ 10 um |
Seqha / Warp | ≤ 20 um |
Surface Finish | DSP/SSP |
Laser Mark |
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Kereiti | Epi polished grade / mechanical grade |