Li-substrates tsa GaAs li arotsoe ka conductive le semi-insulating, tse sebelisoang haholo ka laser (LD), semiconductor light-emitting diode (LED), near-infrared laser, quantum well-high-power laser le liphanele tsa letsatsi tse sebetsang hantle haholo. HEMT le HBT chips bakeng sa radar, microwave, millimeter wave kapa likhomphutha tsa lebelo le phahameng haholo le puisano ea optical; Lisebelisoa tsa maqhubu a seea-le-moea bakeng sa puisano e se nang mohala, 4G, 5G, puisano ea sathelaete, WLAN.
Haufinyane tjena, li-substrates tsa gallium arsenide le tsona li hatetse pele haholo ho mini-LED, Micro-LED, le LED e khubelu, 'me li sebelisoa haholo lisebelisoa tse aparoang tsa AR/VR.
Diameter | 50 limilimithara | 75 limilimithara | 100 limilimithara | 150 limilimithara |
Mokhoa oa Kholo | LEC液封直拉法 |
Botenya ba Wafer | 350mm ~ 625 um |
Boitloaelo | <100> / <111> / <110> kapa tse ling |
Mofuta oa Conductive | P – mofuta / N – mofuta / Semi-insulating |
Mofuta/Dopant | Zn / Si / undoped |
Boiketlo ba Mojari | 1E17 ~ 5E19 cm-3 |
Resistivity ho RT | ≥1E7 bakeng sa SI |
Motsamao | ≥4000 |
EPD( Etch Pit Density) | 100~1E5 |
TTV | ≤ 10 um |
Seqha / Warp | ≤ 20 um |
Surface Finish | DSP/SSP |
Laser Mark |
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Kereiti | Epi polished grade / mechanical grade |